Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions

In this work, a novel testing system has been employed to facilitate the estimation of the reliability of solder interconnects under the combined influence of EM and mechanical strain. The system subjects solder interconnects to high current density, elevated ambient temperature, and a constant tensile stress while recording the change in electrical resistance and change in length of the solder over time. The solder samples were created using two copper wires connected by a eutectic Pb/Sn solder ball to imitate flip-chip or BGA packaging interconnects, allowing for controlled testing conditions in order to demonstrate the combined effects of a mechanical load and EM on the lifetime of a solder joint. A significant reduction in lifetime was observed for samples which endured the coupled accelerating factors. Comparing the experimental results of different current densities at different stress levels provided a new outlook on the nature of coupled failure acceleration in solders. This novel test methodology can inform model generation for better anticipating the failure rate of solder interconnects which naturally experience multiple stress inputs during their lifetime.