切屑空气冷却过程模型的建立及其比例积分微分调节

IF 2.2 4区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Electronic Packaging Pub Date : 2023-05-15 DOI:10.1115/1.4062530
Linmeng Xu, Wanying Zhao, Junhui Li
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引用次数: 0

摘要

芯片结温度是影响芯片正常工作的关键因素。集成电路技术的发展带来了高集成度和低成本,但也对冷却系统提出了更高的要求。本文以芯片的风冷为研究重点,基于英特尔系列微控制器的通用名称MCS-52建立了硬件测试平台,并基于节能原理、传热理论和有限元方法,在MATLAB平台上建立了芯片风冷过程的数学模型。通过提出等效对流换热系数,可以很好地估计系统的热阻。该模型可以很容易地实现芯片、散热器和控制策略的联合仿真,克服了传统有限元仿真软件难以与控制策略相结合的缺点。此外,基于该模型,对比例积分微分(PID)控制参数进行了自动优化,取得了良好的温度控制效果,证明了通过该模型优化控制参数的可行性。
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Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
Chip junction temperature is a key factor affecting the normal operation of the chip. The development of integrated circuit technology brings about high integration and low cost, but it also puts forward higher requirements for the cooling system. This paper focuses on the air cooling of the chip, builds a hardware test platform based on MCS-52, the general name of the intel series microcontroller unit, and sets up a mathematical model of the air cooling process of the chip on the MATLAB platform based on the principle of energy conservation, heat transfer theory and finite element method. By proposing the equivalent convective heat transfer coefficient, the thermal resistance of the system can be well estimated. This model can easily realize the joint simulation of chip, heat radiator and control strategy, which overcomes the disadvantage that traditional finite element simulation software are difficult to combine with control strategy. In addition, based on the model, the proportional integral differential (PID) control parameters are automatically optimized, achieving excellent temperature control effect, and proving the feasibility of optimizing the control parameters through the model.
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来源期刊
Journal of Electronic Packaging
Journal of Electronic Packaging 工程技术-工程:电子与电气
CiteScore
4.90
自引率
6.20%
发文量
44
审稿时长
3 months
期刊介绍: The Journal of Electronic Packaging publishes papers that use experimental and theoretical (analytical and computer-aided) methods, approaches, and techniques to address and solve various mechanical, materials, and reliability problems encountered in the analysis, design, manufacturing, testing, and operation of electronic and photonics components, devices, and systems. Scope: Microsystems packaging; Systems integration; Flexible electronics; Materials with nano structures and in general small scale systems.
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