108 MW/cm2功率因数的β-Ga2O3横向扩散金属氧化物半导体场效应晶体管的500 V击穿电压

IF 1 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC Iet Circuits Devices & Systems Pub Date : 2023-05-03 DOI:10.1049/cds2.12158
Nesa Abedi Rik, Ali. A. Orouji, Dariush Madadi
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引用次数: 5

摘要

作者提出了一种具有β-Ga2O3的绝缘体上硅(SOI)横向扩散金属氧化物半导体场效应晶体管(LDMOSFET),它是一种大带隙半导体(β-LDMOSFET。基本目的是使用β-Ga2O3半导体代替硅材料,因为其击穿场大。分析了β-LDMOSFET的VBR、导通电阻(RON)、功率因数(PFOM)和射频(RF)等特性。研究了射频对栅极-漏极电容、栅极-源极电容、渡越频率和最大振荡频率的影响。β-LDMOSFET结构在VBR中的性能优于VBR,它将其提高到500,而在标准LDMOS FET设计中为84.4 V。所提出的βLDMOSFET的RON~2.3 mΩ.cm−2,并将PFOM(VBR2/RON)提高到108.6 MW/cm2。所有的仿真都是用TCAD完成的,仿真模型是用实验数据校准的。
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500 V breakdown voltage in β-Ga2O3 laterally diffused metal-oxide-semiconductor field-effect transistor with 108 MW/cm2 power figure of merit

The authors’ present a silicon-on-insulator (SOI) laterally diffused metal-oxide-semiconductor field-effect transistor (LDMOSFET) with β-Ga2O3 , which is a large bandgap semiconductor (β-LDMOSFET), for increasing breakdown voltage (VBR) and power figure of merit. The fundamental purpose is to use a β-Ga2O3 semiconductor instead of silicon material due to its large breakdown field. The characteristics of β-LDMOSFET are analysed to those of standard LDMOSFET, such as VBR, ON-resistance (RON), power figure of merit (PFOM), and radio frequency (RF) performances. The effects of RF, such as gate-drain capacitance (CGD), gate-source capacitance (CGS), transit frequency (fT), and maximum frequency of oscillation (fMAX) have been investigated. The β-LDMOSFET structure outperforms performance in the VBR by increasing it to 500 versus 84.4 V in standard LDMOSFET design. The suggested β-LDMOSFET has RON ~ 2.3 mΩ.cm−2 and increased the PFOM (VBR2/RON) to 108.6 MW/cm2. All the simulations are done with TCAD and simulation models are calibrated with the experimental data.

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来源期刊
Iet Circuits Devices & Systems
Iet Circuits Devices & Systems 工程技术-工程:电子与电气
CiteScore
3.80
自引率
7.70%
发文量
32
审稿时长
3 months
期刊介绍: IET Circuits, Devices & Systems covers the following topics: Circuit theory and design, circuit analysis and simulation, computer aided design Filters (analogue and switched capacitor) Circuit implementations, cells and architectures for integration including VLSI Testability, fault tolerant design, minimisation of circuits and CAD for VLSI Novel or improved electronic devices for both traditional and emerging technologies including nanoelectronics and MEMs Device and process characterisation, device parameter extraction schemes Mathematics of circuits and systems theory Test and measurement techniques involving electronic circuits, circuits for industrial applications, sensors and transducers
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