两步CVD/溅射法制备ϵ-Fe2O3纳米棒表面的CuO修饰**

Davide Barreca, Giorgio Carraro, Daniel Peeters, Alberto Gasparotto, Chiara Maccato, Wilhelmus M. M. Kessels, Valentino Longo, Francesca Rossi, Elza Bontempi, Cinzia Sada, Anjana Devi
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引用次数: 11

摘要

本文报道了用两步气相合成方法制备Fe2O3/CuO复合材料的第一个例子。目标路线是基于Fe(hfa)2TMEDA (hfa = 1,1,1,5,5,5-六氟-2,4-戊二酸)在400°C下在Si(100)上CVD Fe2O3纳米棒阵列;TMEDA = N,N,N ',N ' -四亚甲基乙二胺),然后进行不同工艺持续时间的射频(RF)铜溅射,最后在空气中异地退火。互补结构、形态和化学分析的结合使用证明了纯纳米复合体系的形成,其特征是存在鞋底ϵ-Fe2O3和CuO相。所采用的方法的独特之处是,通过直径为几纳米的CuO纳米颗粒可以有效地修饰ϵ-Fe2O3棒的表面,从而使两种氧化物之间紧密接触,并且CuO含量可以通过鞋底溅射时间的变化来调节。
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Surface Decoration of ϵ-Fe2O3 Nanorods by CuO Via a Two-Step CVD/Sputtering Approach**

In this paper we report on the first example of Fe2O3/CuO composites fabricated by a two-step vapor-phase synthetic strategy. The target route is based on the CVD of Fe2O3 nanorod arrays on Si(100) at 400 °C starting from Fe(hfa)2TMEDA (hfa = 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate; TMEDA = N,N,N′,N′-tetramethylethylenediamine), followed by radio frequency (RF) copper sputtering for various process durations, and final ex-situ annealing in air. The combined use of complementary structural, morphological, and chemical analyses give evidence of the formation of pure nanocomposite systems, characterized by the presence of the sole ϵ-Fe2O3 and CuO phases. The unique features of the adopted approach enable an efficient surface decoration of ϵ-Fe2O3 rods by CuO nanoparticles a few nm in diameter, resulting in an intimate contact between the two oxides, and a CuO content tunable through variations of the sole sputtering time.

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Chemical Vapor Deposition
Chemical Vapor Deposition 工程技术-材料科学:膜
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期刊介绍: Chemical Vapor Deposition (CVD) publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. All papers are peer-reviewed. The journal provides a unified forum for chemists, physicists, and engineers whose publications on chemical vapor deposition have in the past been spread over journals covering inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
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