滞流CVD反应器中泵送效应引起的流场不均匀性的研究与改进

Mei-Jiau Huang, Chien-Chou Weng
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引用次数: 2

摘要

为了沉积均匀厚度的薄膜,通常在CVD反应器中使用流动整流器。尽管这些整流器是有效的,但由于流动和浮力效应的变化,在反应室内仍然存在一定程度的流动不均匀性。本文研究了非轴对称泵送系统,特别是单个和非环形泵送出口引起的非均匀性。泵送衬管通过嵌入的通道引导流体混合物进入与泵送出口相连的环形腔室,以改善流动均匀性。分析了泵送系统中各部件的流动阻力,提出了两种精心设计的泵送衬管,其通道半径不均匀或间距不均匀。泵送效应通过不均匀的通道流动阻力得到平衡,在反应室内形成轴对称流场。这种平衡在模拟中得到了证实。
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An Investigation into, and Improvement of, the Non-uniformity of the Flow Field caused by the Pumping Effect in a Stagnation Flow CVD Reactor

To deposit a film with uniform thickness, flow rectifiers are often used in a CVD reactor. Despite the effectiveness of these rectifiers, some degree of flow non-uniformity persists within the reaction chamber, due to variations in the flow and buoyancy effects. Here, the non-uniformity caused by the non-axisymmetric pumping system, specifically a single and non-annular pumping outlet, is investigated. A pumping liner, which directs the fluid mixture through embedded channels into a ring chamber connected to the pumping outlet, is used to improve flow uniformity. The flow resistance associated with each component in the pumping system is analyzed, then two carefully designed pumping liners, the channels of which either have non-uniform radii or are unevenly spaced, are proposed. The pumping effect is balanced through the non-uniform channel flow resistances, giving an axisymmetric flow field in the reaction chamber. This balance is confirmed in simulations.

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Chemical Vapor Deposition
Chemical Vapor Deposition 工程技术-材料科学:膜
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期刊介绍: Chemical Vapor Deposition (CVD) publishes Reviews, Short Communications, and Full Papers on all aspects of chemical vapor deposition and related technologies, along with other articles presenting opinion, news, conference information, and book reviews. All papers are peer-reviewed. The journal provides a unified forum for chemists, physicists, and engineers whose publications on chemical vapor deposition have in the past been spread over journals covering inorganic chemistry, materials chemistry, organometallics, applied physics and semiconductor technology, thin films, and ceramic processing.
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