一种新型混合光子晶体功率/接地层的设计与实现,用于宽带功率噪声抑制

Guanqun Wu, Yi-Che Chen, Tzong-Lin Wu
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引用次数: 19

摘要

通过在封装衬底中周期性嵌入高k棒,提出了一种具有阻带增强的混合光子晶体功率/地层(PCPL),用于功率/地噪声抑制。混合PCPL由两种不同的晶格结构组成,它们具有相同的节距,但高k棒的半径不同。利用光子晶体晶格的间隙图,通过对这两个不同的晶格设计补偿的阻带,可以合成增强阻带。本文还提出了一种与封装或印刷电路板(PCB)的标准制造工艺兼容的实现方法。高k棒被认为是类似表面贴装技术(SMT)的组件,环形焊盘与电源/地平面通过通孔连接,设计在封装基板上。制作并测量了混合PCPL的测试样品。实现了3.2 ~ 9.5 GHz的宽阻带,平均噪声抑制为30 dB。这种增强的阻带与间隙图合成和全波模拟的预测结果一致。混合PCPL应用于具有压控振荡器(VCO)电路的封装基板中,证明了其良好的噪声抑制性能。
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Design and Implementation of a Novel Hybrid Photonic Crystal Power/Ground Layer for Broadband Power Noise Suppression
By embedding periodically high-K rods in the package substrate, a hybrid photonic crystal power/ground layers (PCPL) is proposed with stopband enhancement for power/ground noise suppression. The hybrid PCPL consists of two different lattice structures, which have the same pitch but different radii of the high-K rods. Using the gap map of the photonic crystal lattice, the enhanced stopband can be synthesized by designing these two different lattices with compensated stopband. An implementation approach, which is compatible to the standard fabrication process of package or printed circuit board (PCB), is also proposed in this paper. The high-K rods are considered as surface mount technology (SMT)-like components and ring-shaped soldering pads with through-hole-via connecting to power/ground planes are designed on the package substrate. A test sample of the hybrid PCPL is fabricated and measured. A wide stopband from 3.2 to 9.5 GHz is achieved with 30 dB of noise suppression in average. This enhanced stopband is consistent with the prediction both by gap map synthesis and full-wave simulation. The hybrid PCPL is applied in a package substrate with voltage-controlled oscillator (VCO) circuit and excellent noise suppression performance is demonstrated.
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来源期刊
IEEE Transactions on Advanced Packaging
IEEE Transactions on Advanced Packaging 工程技术-材料科学:综合
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