M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma
{"title":"微米级银颗粒低温烧结氮化发光二极管的模具键合","authors":"M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma","doi":"10.1109/TCAPT.2010.2064313","DOIUrl":null,"url":null,"abstract":"Die-bonding for a nitride light-emitting diode (LED) by sintering of micrometer size Ag particles in air at 200°C was investigated. Micrometer size Ag particles absorb oxygen remarkably well at 200°C and above, and on sintering, they form a porous layer. The activating temperature of the sintering is in good agreement with the oxygen adsorption temperature. Sintering does not progress in the absence of oxygen. A reduction of thermal resistance and an improvement of reliability are achieved by the sintered layer as a die attach to a surface-mount-type LED. This mounting method is useful in the die bonding of electronic components, and is an alternative technique to high-temperature lead soldering.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"7 1","pages":"801-808"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2064313","citationCount":"39","resultStr":"{\"title\":\"Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles\",\"authors\":\"M. Kuramoto, S. Ogawa, M. Niwa, Keun-Soo Kim, K. Suganuma\",\"doi\":\"10.1109/TCAPT.2010.2064313\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Die-bonding for a nitride light-emitting diode (LED) by sintering of micrometer size Ag particles in air at 200°C was investigated. Micrometer size Ag particles absorb oxygen remarkably well at 200°C and above, and on sintering, they form a porous layer. The activating temperature of the sintering is in good agreement with the oxygen adsorption temperature. Sintering does not progress in the absence of oxygen. A reduction of thermal resistance and an improvement of reliability are achieved by the sintered layer as a die attach to a surface-mount-type LED. This mounting method is useful in the die bonding of electronic components, and is an alternative technique to high-temperature lead soldering.\",\"PeriodicalId\":55013,\"journal\":{\"name\":\"IEEE Transactions on Components and Packaging Technologies\",\"volume\":\"7 1\",\"pages\":\"801-808\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2064313\",\"citationCount\":\"39\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components and Packaging Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TCAPT.2010.2064313\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2010.2064313","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Die Bonding for a Nitride Light-Emitting Diode by Low-Temperature Sintering of Micrometer Size Silver Particles
Die-bonding for a nitride light-emitting diode (LED) by sintering of micrometer size Ag particles in air at 200°C was investigated. Micrometer size Ag particles absorb oxygen remarkably well at 200°C and above, and on sintering, they form a porous layer. The activating temperature of the sintering is in good agreement with the oxygen adsorption temperature. Sintering does not progress in the absence of oxygen. A reduction of thermal resistance and an improvement of reliability are achieved by the sintered layer as a die attach to a surface-mount-type LED. This mounting method is useful in the die bonding of electronic components, and is an alternative technique to high-temperature lead soldering.
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