{"title":"沟槽式微通道散热器的多目标优化","authors":"D. Ansari, A. Husain, Kwang‐Yong Kim","doi":"10.1109/TCAPT.2010.2070874","DOIUrl":null,"url":null,"abstract":"The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"767-776"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070874","citationCount":"41","resultStr":"{\"title\":\"Multiobjective Optimization of a Grooved Micro-Channel Heat Sink\",\"authors\":\"D. Ansari, A. Husain, Kwang‐Yong Kim\",\"doi\":\"10.1109/TCAPT.2010.2070874\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.\",\"PeriodicalId\":55013,\"journal\":{\"name\":\"IEEE Transactions on Components and Packaging Technologies\",\"volume\":\"33 1\",\"pages\":\"767-776\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-22\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2070874\",\"citationCount\":\"41\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components and Packaging Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TCAPT.2010.2070874\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2010.2070874","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Multiobjective Optimization of a Grooved Micro-Channel Heat Sink
The shape optimization of a micro-channel heat sink with a grooved structure has been performed using a multiobjective evolutionary algorithm. The thermal-resistance and pumping-power characteristics of the micro-channel heat sink have been investigated numerically. For optimization, four design variables, i.e., the ratios of the groove depth to the micro-channel height, the groove pitch to the micro-channel height, the groove diameter to pitch, and the micro-channel width to height are selected. The thermal resistance and the pumping power are the objective functions. The Navier-Stokes and energy equations for laminar flow and conjugate heat transfer are solved using a finite-volume solver. In comparison with a smooth micro-channel, a decrease in the thermal resistance and an increase in the Nusselt number are obtained in a grooved micro-channel at the expense of pumping power. The thermal resistance in a grooved micro-channel is lower than that in a smooth micro-channel for a fixed pumping power. The ratio of the groove pitch to micro-channel height is found to be the most Pareto-sensitive (sensitive along the Pareto-optimal front), whereas the ratio of the micro-channel width to height is found to be the least Pareto-sensitive variable.