编辑-科学、技术和产业政策

M. Pecht, L. Zuga
{"title":"编辑-科学、技术和产业政策","authors":"M. Pecht, L. Zuga","doi":"10.1109/TCAPT.2010.2078350","DOIUrl":null,"url":null,"abstract":"This editorial presents a case for the development of cohesive and non-partisan industrial and S&T policies that will foster engagement with other countries in the development of S&T. Examples of China and the U.S. are presented.","PeriodicalId":55013,"journal":{"name":"IEEE Transactions on Components and Packaging Technologies","volume":"33 1","pages":"836-839"},"PeriodicalIF":0.0000,"publicationDate":"2010-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2078350","citationCount":"0","resultStr":"{\"title\":\"Editorial - Science, Technology, and Industrial Policy\",\"authors\":\"M. Pecht, L. Zuga\",\"doi\":\"10.1109/TCAPT.2010.2078350\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This editorial presents a case for the development of cohesive and non-partisan industrial and S&T policies that will foster engagement with other countries in the development of S&T. Examples of China and the U.S. are presented.\",\"PeriodicalId\":55013,\"journal\":{\"name\":\"IEEE Transactions on Components and Packaging Technologies\",\"volume\":\"33 1\",\"pages\":\"836-839\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2010-11-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1109/TCAPT.2010.2078350\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IEEE Transactions on Components and Packaging Technologies\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/TCAPT.2010.2078350\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE Transactions on Components and Packaging Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TCAPT.2010.2078350","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

这篇社论提出了一个制定有凝聚力和无党派的工业和科技政策的案例,这些政策将促进与其他国家在科技发展方面的合作。以中国和美国为例。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Editorial - Science, Technology, and Industrial Policy
This editorial presents a case for the development of cohesive and non-partisan industrial and S&T policies that will foster engagement with other countries in the development of S&T. Examples of China and the U.S. are presented.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Venipuncture-related traumatic neuroma of the ulnar nerve on the dorsal of a hand: A case report. CFTR pharmacology. Editorial For a Brighter Future: Solid State Lighting Influence of Die Attach Layer on Thermal Performance of High Power Light Emitting Diodes Electrical Contact Resistance in Thin $({\leq}{\rm 0.5}~\mu{\rm m})$ Gold Plated Contacts: Effect of Gold Plating Thickness
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1