Simon Schambeck, M. Hutter, J. Jaeschke, A. Deutinger, M. Schneider-Ramelow
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Sporadic Early Life Solder Ball Detachment Effects on Subsequent Microstructure Evolution and Fatigue of Solder Joints in Wafer-Level Chip-Scale Packages
Abstract The combination of continuous miniaturization of electronics and the demanding reliability requirements for industrial and automotive electronics is one big challenge for emerging packagin...
期刊介绍：
The International Microelectronics And Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies through professional education. The Society’s portfolio of technologies is disseminated through symposia, conferences, workshops, professional development courses and other efforts. IMAPS currently has more than 4,000 members in the United States and more than 4,000 international members around the world.
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