{"title":"退火过程中电场加速Cu/Ru/TaN/Si堆叠界面扩散","authors":"L. Wang, Z. Cao, J. Syed, K. Hu, Q. She, X. Meng","doi":"10.1149/2.023206ESL","DOIUrl":null,"url":null,"abstract":"Interface diffusion in Cu/Ru/TaN/Si stacks was investigated at different temperatures with and without electric field. It was found that electric field annealing accelerated the interface diffusion of Cu/Ru/TaN/Si. The accelerated interface diffusion is attributed to the accelerated mobility of vacancies and atoms by external electric field. A stronger accelerating effect was found on Ru/TaN interface, which resulted from accelerated N atom diffusion and the polarization of vacancies in TaN layer. © 2012 The Electrochemical Society. [DOI: 10.1149/2.023206esl] All rights reserved.","PeriodicalId":11627,"journal":{"name":"Electrochemical and Solid State Letters","volume":"11 39","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2012-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://sci-hub-pdf.com/10.1149/2.023206ESL","citationCount":"13","resultStr":"{\"title\":\"Electric Field Accelerating Interface Diffusion in Cu/Ru/TaN/Si Stacks during Annealing\",\"authors\":\"L. Wang, Z. Cao, J. Syed, K. Hu, Q. She, X. Meng\",\"doi\":\"10.1149/2.023206ESL\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Interface diffusion in Cu/Ru/TaN/Si stacks was investigated at different temperatures with and without electric field. It was found that electric field annealing accelerated the interface diffusion of Cu/Ru/TaN/Si. The accelerated interface diffusion is attributed to the accelerated mobility of vacancies and atoms by external electric field. A stronger accelerating effect was found on Ru/TaN interface, which resulted from accelerated N atom diffusion and the polarization of vacancies in TaN layer. © 2012 The Electrochemical Society. [DOI: 10.1149/2.023206esl] All rights reserved.\",\"PeriodicalId\":11627,\"journal\":{\"name\":\"Electrochemical and Solid State Letters\",\"volume\":\"11 39\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2012-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"https://sci-hub-pdf.com/10.1149/2.023206ESL\",\"citationCount\":\"13\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrochemical and Solid State Letters\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1149/2.023206ESL\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrochemical and Solid State Letters","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1149/2.023206ESL","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
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