使用多模光纤和850 VCSEL阵列进行高速并行互连

LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242) Pub Date : 2001-11-12 DOI:10.1109/LEOS.2001.969078

P.L. Pondillo

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引用次数: 1

摘要

本文简要概述了高速互连市场，并讨论了为什么50微米多模光纤带与VCSEL阵列技术相结合是该市场的最佳解决方案。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Use of multimode fiber and 850 VCSEL arrays for high-speed parallel interconnects

A brief overview of the high-speed interconnect market is presented, along with a discussion of why 50 micron multimode fiber ribbon coupled with VCSEL array technology makes the most sense as the optimal solution for this market.

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LEOS 2001. 14th Annual Meeting of the IEEE Lasers and Electro-Optics Society (Cat. No.01CH37242)

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