Kyu-ho Shin, C. Moon, T. Lee, Chang-Hyun Lim, Youngjin Kim
{"title":"可植入柔性无线压力传感器模块","authors":"Kyu-ho Shin, C. Moon, T. Lee, Chang-Hyun Lim, Youngjin Kim","doi":"10.1109/ICSENS.2004.1426302","DOIUrl":null,"url":null,"abstract":"A chip embedded flexible packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50 /spl mu/m) are fabricated by a chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing an implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessels.","PeriodicalId":20476,"journal":{"name":"Proceedings of IEEE Sensors, 2004.","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2004-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"12","resultStr":"{\"title\":\"Implantable flexible wireless pressure sensor module\",\"authors\":\"Kyu-ho Shin, C. Moon, T. Lee, Chang-Hyun Lim, Youngjin Kim\",\"doi\":\"10.1109/ICSENS.2004.1426302\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A chip embedded flexible packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50 /spl mu/m) are fabricated by a chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing an implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessels.\",\"PeriodicalId\":20476,\"journal\":{\"name\":\"Proceedings of IEEE Sensors, 2004.\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"12\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings of IEEE Sensors, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ICSENS.2004.1426302\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of IEEE Sensors, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSENS.2004.1426302","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A chip embedded flexible packaging scheme has been developed using a thinned silicon chip. Mechanical characteristics of thinned silicon chips are examined by bending test and finite element analysis. Thinned silicon chips (t<50 /spl mu/m) are fabricated by a chemical etching process to avoid possible surface damage. These technologies can be used for an implantable real-time monitoring of blood pressure. Our research targets are developing an implantable blood pressure sensor module and its telemetric measurement. By winding around the coronary arteries, we can measure the blood pressure by capacitance variation of blood vessels.
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