新型一维和二维VCSEL阵列的先进封装技术

R. Dohle, Gerold Henning, Maximilian Wallrodt, C. Gréus, C. Neumeyr
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引用次数: 4

摘要

在本文中,我们提出了一种优化的特殊长波一维和二维垂直腔面发射激光二极管(VCSEL)阵列的制造技术,重点是模具键合和特殊的线键合工艺,以及其他可能性,以提高生产效率,提高产品质量,可靠性和寿命。VCSEL阵列具有非常广泛的应用潜力。本文的目标是开发一种具有高定位精度的长波长VCSEL阵列的组装技术,用于自动化生产,具有高总产量,使用金基导电胶(因为银迁移是一个问题)确保高产量,极高的可靠性和寿命。由于客户的特殊要求,导电胶的最终厚度为35微米,标准偏差低。为了获得最高的可靠性,客户要求将VCSEL的顶部触点与具有金金属化的硅衬底的金丝结合。利用所描述的技术,我们开发和生产具有专用波长,性能和包装选项的客户特定产品。根据我们的发现,非常灵活和可扩展的解决方案是可能的,可以匹配许多不同的应用。最后,我们将概述我们在VCSEL器件的物理和电光特性方面的研究结果。这产生了一种非常高效的制造技术,满足了上面提到的要求。VCSEL的特殊设计特点确保了固化导电胶层相对较高的热阻不会损害VCSEL的光电性能或使用寿命。对于顶部侧触点的互连,我们使用直径为20微米的金线,采用球楔,具有特殊环形几何形状的standoff Stich Bond工艺,根据客户要求。由于VCSELs半导体材料的特性,需要较低的键合温度,这是通过我们特殊的线键合工艺实现的。金丝粘接取得了优异的效果,远远超过了客户的要求。vcsel的光谱和其他测量表明,组装过程不会损害激光二极管或其电光性能。满足了客户对一维和二维VCSEL阵列的所有要求。光电和老化数据证明了工程装配技术的质量。由于VCSEL阵列的新颖制造工艺和创新封装,为低电流和大电流激光阵列开发的技术将为大量新应用提供新设备。
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Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays
In this paper we present an optimized manufacturing technique for special long-wavelength 1-dimensional and 2-dimensional Vertical Cavity Surface Emitting Laser Diode (VCSEL) arrays with focus on die bonding and a special wire bonding process as well as additional possibilities to make the manufacturing more productive and to increase the product quality, reliability, and life time. VCSEL arrays have a very broad application potential. Objective of this paper is the development of an assembly technology for long-wavelength VCSEL arrays with high positioning accuracy for automated production with high total yield, using gold-based conductive glue (because silver migration is a concern) securing high yield and extremely high reliability and lifetime. Due to special customer requirements, a final thickness of the conductive glue of 35 micron with low standard deviation is necessary. For highest reliability, gold wire bonding of the top side contact of the VCSEL to a silicon substrate with gold metallization has been a customer requirement. With the described technique we develop and produce customer specific products with dedicated wavelength, performance, and packaging options. Bases on our findings, very flexible and scalable solutions are possible, matching many different applications. Finally, we will present an overview of our results on the physical and electro-optical characterization of the VCSEL devices. This yielded a very productive manufacturing technique, meeting the requirements mentioned above. Special design features of the VCSEL ensure that the relatively high thermal resistance of the cured conductive glue layer does not impair the electro-optical properties or the lifetime of the VCSELs. For the interconnection of the top side contact we used gold wire with 20 microns diameter, using ball-wedge, Stand-Off Stich Bond process with special loop geometry, required by the customer. Due to the properties of the semiconductor material of the VCSELs a low bonding temperature is required, enabled by our special wire bonding process. Gold wire bonding delivered excellent results, by far exceeding the customer specification. The optical spectrum of the VCSELs and other measurements indicate that the assembly processes do not harm the laser diodes or their electro-optical properties. All customer requirements for the 1-dimensional and 2-dimensional VCSEL arrays have been met. The electro-optical and burn-in data furnished proof of the quality of the engineered assembly technology. The technologies developed for low current as well as high current laser arrays will enable new devices for a huge amount of new applications because of the novel manufacturing processes as well as innovative packaging of the VCSEL arrays.
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