电解沉积工艺均匀性对提高先进封装可靠性的关键作用

Ralf Schmidt, Jens Palm, J. Knaup
{"title":"电解沉积工艺均匀性对提高先进封装可靠性的关键作用","authors":"Ralf Schmidt, Jens Palm, J. Knaup","doi":"10.4071/1085-8024-2021.1.000142","DOIUrl":null,"url":null,"abstract":"\n Heterogeneous integration is considered as the key technology to create large, complex System in Package (SiP) assemblies of separately manufactured, smaller components. Proper control of the uniformity of each process step constitutes one of the main challenges during integration of the different components into a higher-level assembly. In this context, processes that create thick layers by electrochemical deposition are especially susceptible to variations across the substrate. Such processes include copper pillar and bump as well as tin-silver applications. Insufficient coplanarity of electrolytic copper would result in significant reliability issues or evolution of stress in the package. Upcoming hybrid bump designs with features of different dimensions pose additional challenges to the electrolytic copper and tin-silver processes. Purposeful adjustment of differences between the heights of pillars of different diameters may be required after the copper process step in order to obtain the best uniformity for the complete stack with tin-silver on top. In addition to coplanarity, the electrolytic process should allow modification shape of the individual pillar or bump. In this context, a versatile copper electrodeposition process will be discussed that allows adjustment to a broad variety of uniformity parameters and combinations thereof. In combination with suitable tin-silver deposition processes, this process is expected to significantly improve the reliability of copper pillars and bumps for advanced packaging applications.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"1 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2021-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging\",\"authors\":\"Ralf Schmidt, Jens Palm, J. Knaup\",\"doi\":\"10.4071/1085-8024-2021.1.000142\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n Heterogeneous integration is considered as the key technology to create large, complex System in Package (SiP) assemblies of separately manufactured, smaller components. Proper control of the uniformity of each process step constitutes one of the main challenges during integration of the different components into a higher-level assembly. In this context, processes that create thick layers by electrochemical deposition are especially susceptible to variations across the substrate. Such processes include copper pillar and bump as well as tin-silver applications. Insufficient coplanarity of electrolytic copper would result in significant reliability issues or evolution of stress in the package. Upcoming hybrid bump designs with features of different dimensions pose additional challenges to the electrolytic copper and tin-silver processes. Purposeful adjustment of differences between the heights of pillars of different diameters may be required after the copper process step in order to obtain the best uniformity for the complete stack with tin-silver on top. In addition to coplanarity, the electrolytic process should allow modification shape of the individual pillar or bump. In this context, a versatile copper electrodeposition process will be discussed that allows adjustment to a broad variety of uniformity parameters and combinations thereof. In combination with suitable tin-silver deposition processes, this process is expected to significantly improve the reliability of copper pillars and bumps for advanced packaging applications.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"1 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/1085-8024-2021.1.000142\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/1085-8024-2021.1.000142","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

异构集成被认为是创建大型、复杂的系统封装(SiP)组件的关键技术,这些组件是由单独制造的较小的组件组成的。在将不同组件集成到更高级别的装配中,对每个工艺步骤的均匀性的适当控制构成了主要挑战之一。在这种情况下,通过电化学沉积产生厚层的工艺特别容易受到衬底变化的影响。这些工艺包括铜柱和凸块以及锡银应用。电解铜的共面性不足将导致严重的可靠性问题或封装中应力的演变。即将到来的具有不同尺寸特征的混合凸点设计对电解铜和锡银工艺提出了额外的挑战。在铜工艺步骤后,可能需要有目的地调整不同直径柱的高度差异,以获得顶部有锡银的整个堆的最佳均匀性。除了共面性外,电解过程还应允许修改单个支柱或凸起的形状。在这种情况下,将讨论一种通用的铜电沉积工艺,该工艺允许调整各种均匀性参数及其组合。结合合适的锡银沉积工艺,该工艺有望显著提高铜柱和凸点的可靠性,用于先进的封装应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging
Heterogeneous integration is considered as the key technology to create large, complex System in Package (SiP) assemblies of separately manufactured, smaller components. Proper control of the uniformity of each process step constitutes one of the main challenges during integration of the different components into a higher-level assembly. In this context, processes that create thick layers by electrochemical deposition are especially susceptible to variations across the substrate. Such processes include copper pillar and bump as well as tin-silver applications. Insufficient coplanarity of electrolytic copper would result in significant reliability issues or evolution of stress in the package. Upcoming hybrid bump designs with features of different dimensions pose additional challenges to the electrolytic copper and tin-silver processes. Purposeful adjustment of differences between the heights of pillars of different diameters may be required after the copper process step in order to obtain the best uniformity for the complete stack with tin-silver on top. In addition to coplanarity, the electrolytic process should allow modification shape of the individual pillar or bump. In this context, a versatile copper electrodeposition process will be discussed that allows adjustment to a broad variety of uniformity parameters and combinations thereof. In combination with suitable tin-silver deposition processes, this process is expected to significantly improve the reliability of copper pillars and bumps for advanced packaging applications.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Advanced Packaging Technology for Novel 1-dimensional and 2-dimensional VCSEL Arrays The Pivotal Role of Uniformity of Electrolytic Deposition Processes to Improve the Reliability of Advanced Packaging Enhancing the Paste Release on 55μm pads with Water-Soluble Type 7 SAC305 Solder Paste for High Density SIP Application Coronavirus, chip boom, and supply shortage: The new normal for global semiconductor manufacturing Lithography Solutions for Submicron Panel-Level Packaging
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1