沉积温度和热处理对AZO纳米层膜性能的影响

J. Guan, Q. Duanmu
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引用次数: 1

摘要

首先,采用原子层沉积法(ALD)在石英和n掺杂Si(100)衬底上制备了AZO纳米层膜。利用原子力显微镜(AFM)、x射线衍射仪(XRD)和高阻测试仪对膜的表面形貌、晶体结构和电学性能进行了分析和表征。然后比较了不同衬底温度和热处理工艺对薄膜结构和性能的影响。研究了衬底温度和退火温度对薄膜结构和性能的影响。最后,研究结果表明,AZO纳米层膜具有合适的温度窗。当衬底温度至少为170℃时,即满足微通道板(MCP)导电层薄膜的要求。同时,薄膜的电阻率随退火温度的升高而增大,适当的退火有利于薄膜结构的优化。在400℃退火4h时,薄膜电阻应该是稳定的,这意味着它可以被视为未来MCP dynode导电层薄膜的选择。
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Effect of deposition temperature and heat treatment on properties of AZO nanolamination films
Firstly, the AZO nanolaminated films are prepared on quartz and n-doped Si(100) substrate by atomic layer deposition (ALD). And the surface morphology, crystal structure and electrical properties of the films are analyzed and characterized by atomic force microscopy (AFM), X-ray diffraction (XRD) and high resistance tester. Thereafter the paper the effects of different substrate temperature is compared with heat treatment process on the structure and properties of the films. The effects of substrate temperature and annealing temperature on the structure and properties of the films are studied. Finally, the results of research indicates that the AZO nanolaminated film has a suitable temperature window. When the substrate temperature at least 170°C which meets the requirement of microchannel plate (MCP) dynode conductive layer film. At the same time, the resistivity of the film increases accordingly with temperature of annealing increasing, as proper annealing can help the structure of the film optimizing. The thin film resistance is supposed to be stable at 400°C annealing for 4h, which means it can be regarded as the option of MCP dynode conductive layer films in the future.
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