超出电气规范的分立功率半导体封装的失效特性

Michael Gleissner, M. Bakran
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引用次数: 4

摘要

功率半导体的故障特性决定了整个系统所需的保护元件和容错能力。为了获得有关故障特征的信息,几个具有不同封装,制造商和额定电压的低压功率mosfet通过超过电气参数而故意破坏栅极和漏极源极电压。此外,还研究了电容放电过程中mosfet的稳定性取决于存储能量的量,这是多电平变换器成功降电平所必需的。研究了基于封装技术的器件故障后行为,为容错应用提供了设计提示。
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Failure characteristics of discrete power semiconductor packages exceeding electrical specifications
The failure characteristics of power semiconductors determine necessary protection elements and fault-tolerance of the total system. To obtain information on failure characteristics, several low voltage power MOSFETs with different packages, manufacturers and voltage ratings are deliberately destroyed by exceeding the electrical parameters gate- and drain-source voltage. Furthermore, the stability of MOSFETs during a capacitor discharging depending on the amount of stored energy is investigated, which is necessary for successful level reduction in multilevel converters. The research focuses on the device behaviour after failure depending on the package technology to give a design hint for fault-tolerant applications.
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