等通道角压Cu-Ag纳米复合材料的力学和电学性能

Kyu-Jin Cho, S. Hong
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引用次数: 0

摘要

在室温条件下对Cu-Ag复合材料进行了等通道角挤压。eced Cu-Ag呈现超细结构,Ag相的形状和分布随工艺路线的不同而不同。在A路线中,Ag相的初始薄片沿剪切方向被拉长并发育成细丝,而在Bc路线中,初始薄片被破碎而变得更细,形状没有明显变化。eced Cu- ag的硬度大于eced Cu的硬度。Cu-Ag中较高的硬度是由于界面处的位错储存和析出硬化使基体得到了更有效的强化。在相同变形应变下,eced Cu-Ag的硬度低于拉制Cu-Ag,这是由于两相丝状组织细化伸长率较低。在Cu-Ag复合材料中应用ECAP可以有效地改变复合材料的结构、形态和相分布,提高复合材料的强度。
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Mechanical and electrical properties of Cu-Ag nanocomposites processed by equal channel angular pressing (ECAP)
Equal channel angular pressing was carried out on Cu-Ag composites at room temperature. ECAPed Cu-Ag exhibited ultrafine structure with the shape and distribution of Ag phase dependent on the processing routes. In route A, the initial lamellae of Ag phase were elongated along the shear direction and developed into filaments whereas the initial lamellae became finer by fragmentation with no pronounced change of the shape in route Bc. The hardness of ECAPed Cu-Ag is greater than that of ECAPed Cu. The higher hardness in Cu-Ag is ascribed to the more effective matrix strengthening due to the dislocation storage at the interface and the precipitation hardening. The hardness of ECAPed Cu-Ag was lower than the drawn Cu-Ag at the same deformation strain because of the less effective refinement and elongation of the two-phase filamentary microstructure. The application of ECAP in Cu-Ag was found to be effective in the modification of structure, shape and distribution of phases in composite and the increase of the strength.
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