{"title":"一种用于低Dk覆铜层压板的新型树脂组成","authors":"June-Che Lu, Yeong-Tong Hwang","doi":"10.1109/IMPACT.2009.5382128","DOIUrl":null,"url":null,"abstract":"Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned. In our newly developed composition containing an epoxy resin, the epoxy resin has a molecular segment with low polarity in the polymer chain where the molecular segment is composed of a structure derived from a symmetric and saturated cycloaliphatic. The structure will reduce the dipole moment of the epoxy resin, so that the copper clad laminate produced from the composition containing the epoxy resin can have a low Dk and low Df","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"97 1","pages":"251-253"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"A novel resin composition for low Dk copper clad laminate\",\"authors\":\"June-Che Lu, Yeong-Tong Hwang\",\"doi\":\"10.1109/IMPACT.2009.5382128\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned. In our newly developed composition containing an epoxy resin, the epoxy resin has a molecular segment with low polarity in the polymer chain where the molecular segment is composed of a structure derived from a symmetric and saturated cycloaliphatic. The structure will reduce the dipole moment of the epoxy resin, so that the copper clad laminate produced from the composition containing the epoxy resin can have a low Dk and low Df\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"97 1\",\"pages\":\"251-253\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382128\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382128","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A novel resin composition for low Dk copper clad laminate
Recently, high frequency signal transmission has been widely used in communication and broadband technologies, and even in mini-electronic devices. When signals travel at a high speed, how to maintain signal integrity becomes an important issue. Therefore, the electric properties in terms of dielectric constant (Dk) and loss factor (Df) of laminate materials for PCB production are more and more concerned. In our newly developed composition containing an epoxy resin, the epoxy resin has a molecular segment with low polarity in the polymer chain where the molecular segment is composed of a structure derived from a symmetric and saturated cycloaliphatic. The structure will reduce the dipole moment of the epoxy resin, so that the copper clad laminate produced from the composition containing the epoxy resin can have a low Dk and low Df
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