K. Matam, B. Peethala, C. Taff, Z. Gardner, Chung Ju Yang, Sankar Muthumanickam, D. Sil
{"title":"湿式清洁工具中工艺室废气对晶圆缺陷的影响","authors":"K. Matam, B. Peethala, C. Taff, Z. Gardner, Chung Ju Yang, Sankar Muthumanickam, D. Sil","doi":"10.1109/ASMC49169.2020.9185285","DOIUrl":null,"url":null,"abstract":"The published paper will discuss the impact of exhaust pressure and velocity on particle performance in wet clean process chambers. Correlations are drawn from chamber exhaust pressure, exhaust velocity, and exhaust duct condition to explain the observed degradation in particle performance. Based on the observations, key solutions including periodic preventative maintenance on exhaust duct lines, chamber wipe downs, exhaust rebalancing are recommended to improve chamber stability and particle performance.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"47 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Impact of Process Chambers Exhaust on Wafer Defectivity in Wet Clean tools\",\"authors\":\"K. Matam, B. Peethala, C. Taff, Z. Gardner, Chung Ju Yang, Sankar Muthumanickam, D. Sil\",\"doi\":\"10.1109/ASMC49169.2020.9185285\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The published paper will discuss the impact of exhaust pressure and velocity on particle performance in wet clean process chambers. Correlations are drawn from chamber exhaust pressure, exhaust velocity, and exhaust duct condition to explain the observed degradation in particle performance. Based on the observations, key solutions including periodic preventative maintenance on exhaust duct lines, chamber wipe downs, exhaust rebalancing are recommended to improve chamber stability and particle performance.\",\"PeriodicalId\":6771,\"journal\":{\"name\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"47 1\",\"pages\":\"1-4\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC49169.2020.9185285\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185285","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Impact of Process Chambers Exhaust on Wafer Defectivity in Wet Clean tools
The published paper will discuss the impact of exhaust pressure and velocity on particle performance in wet clean process chambers. Correlations are drawn from chamber exhaust pressure, exhaust velocity, and exhaust duct condition to explain the observed degradation in particle performance. Based on the observations, key solutions including periodic preventative maintenance on exhaust duct lines, chamber wipe downs, exhaust rebalancing are recommended to improve chamber stability and particle performance.
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