Kitae Song, Byoung Suhk Kim, Jae Wook Lee, H. Rhee
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DSC Studies upon Thermal Curing of Methylsilsesquinoxane
Abstract A conventional DSC was used to investigate the thermal curing behavior of methylsilsesquioxane (MSSQ) which transforms into the low dielectric constant material, poly(MSSQ). Temperature scan of MSSQ up to 350°C revealed that the curing of MSSQ is an endothermic reaction that occurs over the wide temperature range. From the isothermal scan of MSSQ, it was found that the curing of MSSQ follows the first-order reaction.
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