合格的内联Xe等离子FIB -将磨圆重新投入生产

2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) Pub Date : 2020-08-01 DOI:10.1109/ASMC49169.2020.9185315

F. Niedermeier, Rolf Kammerer, W. Kipferl, Stephan Henneck, Haim Pearl

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摘要

本文描述了一项测试计划和几个实验结果，以确定使用内联氙(Xe)等离子体聚焦离子束(PFIB)铣削的晶圆是否可以通过标准生产流程继续加工，而不会因污染、产量或可靠性问题而报废。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Qualifying Inline Xe Plasma FIB - Returning Milled Wafers Back to Production

This paper describes a plan of tests and several results of experiments that were performed to determine whether wafers that were milled using an inline xenon (Xe) plasma focused ion beam (PFIB) could continue processing through the standard production flow without being scrapped for contamination, yield, or reliability issues.

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2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)

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