Mg注入半绝缘InP的电学和光学特性

P. Krauz, E. Rao, B. Descouts, Y. Gao, H. Thibierge
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引用次数: 0

摘要

研究了中剂量Mg植入物在Fe掺杂SI InP中实现浅p/sup +/表面层的方法。讨论了植入体温度、P共植入条件以及植入后退火等参数的影响。结果表明,快速退火(RTA)过程中注入的Ma向外扩散可以通过InP邻近帽退火或P共注入来控制。通过在200℃下植入Mg或在Mg剖面后面实现P共植入,可以减少不良的深度扩散。镁在InP中溶解度的限制被证明是其低电活化的主要原因。在优化的植入和退火条件下,获得了最大的真实Mg活化,晶体完美度高,SI InP中突然出现浅p/sup +/层。
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Electrical and optical characteristics of Mg implanted semi-insulating InP
A study of medium dose Mg implants to achieve shallow p/sup +/ surface layers in Fe doped SI InP is presented. The influence of several parameters, such as the temperature of implants and P co-implant conditions, as well as the post-implant anneals are discussed. It is shown that the out-diffusion of implanted Ma that occurs during rapid thermal annealing (RTA) can be controlled by either InP proximity cap anneals or P co-implants. The undesirable deep in-diffusion can be reduced by performing Mg implants at 200 degrees C or by realizing P co-implants behind the Mg profile. The limitation of Mg solubility in InP is demonstrated to be the principal cause of its low electrical activation. Using the optimized implant and anneal conditions, a maximum of real Mg activation with a high degree of crystal perfection and abrupt shallow p/sup +/ layers in SI InP was achieved.<>
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