Solving CMP Challenges for Chemically Stable Materials and 3D Shapes

In order to expand the use of CMP technologies into new applications, it is necessary to develop polishing technologies for a diverse range of materials and shapes. To improve the material removal rate of chemically stable materials, it is important i) to increase the abrasive particle velocity (vs. polishing object) to maximize the friction, and ii) to increase the number of working (adhered/active) particles by controlling the surface charge. To polish 3D shape precisely, design of polishing consumables (3D pad, magnetic polish slurry, polishing compound) and accurate pressure control are the keys.