无铅电镀中凸点生长形貌的控制

Berdy Weng, Wei-Wei Liu, Lu-Ming Lai, Kuang-Hsiung Chen
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引用次数: 0

摘要

电镀凸点焊是倒装芯片组装方法的关键使能技术之一。倒装芯片组装已经发展到支持更高水平的互连和更小的特征尺寸。与焊接印刷和钢球安装相比,电镀是一种非常有前途的技术,具有更精细的凹凸特征。因此,凸点形貌对工艺质量控制和设计实现具有重要意义。本文旨在研究从镀前蘑菇状结构到回流凹凸阶段光刻胶上浆的镀锡行为。此外,本活动将考虑完整的碰撞过程集成相对于电镀焊料碰撞设计规则。
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Control of Solder Bump Growing Morphology in Lead Free Plating
Plating Solder bump is one of the key enabling technologies for flip chip assembly methodology. Flip chip assembly has advanced to support higher levels of interconnect and small feature sizes. Electroplating is a very promising technology for finer bump features when compared with solder printing and ball mounting. Hence, the plated-solder bump morphology is quite important for process quality control and design realization. This paper aims to study the plated solder behavior from as-plated mushroom structure to after reflowed bump stage photoresist sizing. In addition, this activity will consider the full bumping process integration relative to the electroplated solder bump design rules.
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