数值孔径增大透镜与标准地下显微镜的比较

S. Ippolito, B. Goldberg, M. Unlu
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引用次数: 1

摘要

采用数值孔径增大透镜(NAIL)显微镜对硅集成电路(IC)进行亚表面检测,其横向空间分辨率优于0.23 /spl mu/m。我们使用Hamamatsu /spl mu/ amos - 200ic失效分析系统将NAIL显微镜与标准地下显微镜进行比较。NAIL将显微镜的横向空间分辨率从/spl sim/1.7 /spl mu/m提高到/spl sim/0.3 /spl mu/m。由于样品具有多个纵向介质界面,因此难以获得纵向空间分辨率。
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Comparison of numerical aperture increasing lens and standard subsurface microscopy
Subsurface inspection of a Si integrated circuit (IC) by a Numerical Aperture Increasing Lens (NAIL) microscope has yielded a lateral spatial resolution of better than 0.23 /spl mu/m. We compare NAIL microscopy to standard subsurface microscopy using the Hamamatsu /spl mu/AMOS-200, IC Failure Analysis System. The NAIL improves the microscope's lateral spatial resolution from /spl sim/1.7 /spl mu/m to /spl sim/0.3 /spl mu/m. It is difficult to obtain the longitudinal spatial resolution because the sample has multiple longitudinal dielectric interfaces.
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