基于分子动力学计算的石墨烯片与SiC衬底之间的热传递

Zan Wang, Kedong Bi, H. Guan, Jiong Wang
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引用次数: 4

摘要

利用非平衡分子动力学,我们研究了SiC/石墨烯片间的热传递机制。在模拟中,3C-、4H-和6H-SiC分别被考虑。在100k ~ 700k范围内计算了石墨烯与SiC (Si端或c端)之间的界面热阻。结果表明,无论是si端界面还是c端界面,4H-和6H-SiC的界面热阻随温度的变化趋势相似。在100 ~ 600 K的宽温度范围内,3C-SiC的si端界面热阻高于4H-和6H-SiC。但是,对于富c界面,这个范围从350k减小到500k。
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Thermal Transport between Graphene Sheets and SiC Substrate by Molecular-Dynamical Calculation
Using nonequilibrium molecular dynamics, we investigate the mechanisms of thermal transport across SiC/graphene sheets. In simulations, 3C-, 4H-, and 6H-SiC are considered separately. Interfacial thermal resistances between Bernal stacking graphene sheets and SiC (Si- or C-terminated) are calculated at the ranges of 100 K~700 K. The results indicate, whether Si-terminated or C-terminated interface, the interfacial thermal resistances of 4H- and 6H-SiC have similar trends over temperatures. Si-terminated interfacial thermal resistances of 3C-SiC are higher than those of 4H- and 6H-SiC in a wide temperature range from 100 K to 600 K. But, for C-rich interface, this range is reduced from 350 K to 500 K.
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