低功耗微型氢传感器芯片

Hairong Wang, M. Wang, Xiaowei Chen, B. Han
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引用次数: 0

摘要

提出了一种集成式低功耗微型氢气传感器芯片。在同一层上设计了一对交错的感应电极、感应层和围绕它们的加热电极。为实现低功耗,采用湿法蚀刻法释放高导热硅衬底,并保留由Si3N4/SiO2/Si3N4/SiO2四层膜组成的1.3#x03BC;m厚、隔热性能优良的膜来支撑上述结构。退火是为了降低薄膜的应力。利用堆叠后的TiO2/SnO2复合材料对H2进行检测,通过射频磁控溅射,该复合材料由沉积的SnO2和TiO2依次组成6层。将复合材料的制备工艺与传统MEMS工艺相结合,实现了具有良好一致性的晶圆级传感器芯片的量产。H2传感器可在244°C下稳定工作(100-900ppm),功耗低至36mW。
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The micro hydrogen sensor chip with low power consumption
An integrated micro H2 sensor chip with low power consumption is presented. A pair of interdigitated sensing electrodes, sensing layer and heating electrodes surrounding them were designed on the same layer. To realize low power consumption, the silicon substrate with high thermal conduction was released by wet etching and the 1.3#x03BC;m thick membrane with excellent thermal insulation which consists of Si3N4/SiO2/Si3N4/SiO2 four films, was reserved to support the above structure. Annealing was carried out to reduce the stresses of the films. The stacked TiO2/SnO2 composite materials were used to detect H2 and they had six layers consisting of deposited SnO2 and TiO2 through RF magnetron sputtering in turn. The preparation process of the composite materials was combined with the conventional MEMS process to realize mass production of the wafer-level sensor chips with good consistency. The H2 sensor can work steadily for H2 detection (100–900ppm) at 244 °C with low power consumption as 36mW.
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