{"title":"大会总主席陈怡珍致欢迎辞","authors":"Y. Chan","doi":"10.1109/IMPACT.2009.5382152","DOIUrl":null,"url":null,"abstract":"Thanks for paying your attention on International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009), and I cordially welcome your participation of the conference.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"69 1","pages":"1-1"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Welcome message from Yi-Jen Chan, conference general chair\",\"authors\":\"Y. Chan\",\"doi\":\"10.1109/IMPACT.2009.5382152\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thanks for paying your attention on International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009), and I cordially welcome your participation of the conference.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"69 1\",\"pages\":\"1-1\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382152\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382152","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Welcome message from Yi-Jen Chan, conference general chair
Thanks for paying your attention on International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2009), and I cordially welcome your participation of the conference.
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