低重力应用的低成本三轴加速度计的发展道路上的问题

Jen-Yi Chen, L. Liao, H. Chien, C. S. Lin, Y. Hsu
{"title":"低重力应用的低成本三轴加速度计的发展道路上的问题","authors":"Jen-Yi Chen, L. Liao, H. Chien, C. S. Lin, Y. Hsu","doi":"10.1109/IMPACT.2009.5382175","DOIUrl":null,"url":null,"abstract":"The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3×1.28mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434V/g and 49µg/√Hz. The sensitivity and minimum cross-axis sensitivity are 1.442V/g and 0.03% for x-axis and are 1.241V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"84 1","pages":"297-300"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Issues in path toward low cost three-axis accelerometer for low-g application\",\"authors\":\"Jen-Yi Chen, L. Liao, H. Chien, C. S. Lin, Y. Hsu\",\"doi\":\"10.1109/IMPACT.2009.5382175\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3×1.28mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434V/g and 49µg/√Hz. The sensitivity and minimum cross-axis sensitivity are 1.442V/g and 0.03% for x-axis and are 1.241V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"84 1\",\"pages\":\"297-300\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382175\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382175","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

本文提出了优化三轴加速度计实现的若干问题。建立了VerilogA模型进行传感器设计,利用电路工具联合仿真得到了传感器的总体灵敏度、噪声和频率响应。通过理论计算对关键参数进行了优化,并通过有限元分析和综合节点仿真对关键参数进行了微调。三个防弹簧质量系统集成在一个结构上,尺寸为1.3×1.28mm2,工作范围为±2g。采用玻璃上硅(SOG)工艺实现高宽高比结构,z轴灵敏度和分辨率高达1.434V/g和49µg/√Hz。x轴灵敏度和最小跨轴灵敏度分别为1.442V/g和0.03%,y轴灵敏度分别为1.241V/g和0.21%。优化后的设计表现出优异的性能,满足了消费者应用的需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Issues in path toward low cost three-axis accelerometer for low-g application
The paper presents issues for an optimized three-axis accelerometer implementation. A VerilogA model was built for sensor design, the overall sensitivity, noise and frequency response are obtained by co-simulation with circuit tools. The critical parameters were optimized by theoretical calculation and fine tuned by finite-element-analysis (FEA) and integrated nodal simulation. Three spring-proof mass systems were integrated on a single structure in size of 1.3×1.28mm2 for operating range of ±2g. A silicon-on-glass (SOG) process is adopted to achieve the high aspect-ratio structure, yielding excellent Z-axis sensitivity and resolution as high as 1.434V/g and 49µg/√Hz. The sensitivity and minimum cross-axis sensitivity are 1.442V/g and 0.03% for x-axis and are 1.241V/g and 0.21% for y-axis. This optimized design demonstrates excellent performance satisfying the needs of consumer applications.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Estimation design of MEMS-based inertial navigation systems with noise coupling input saturation: Robust approach Experimental investigation and finite element analysis of bump wafer probing Optimum design of contact springs used in registered jack connectors Optimization design of cup-shaped copper heat spreaders for high-power InGaN/sapphire LEDs The high performance electrodeposited copper foil for next generation
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1