{"title":"对封装部件进行封装装配过程评价","authors":"K. C. Li, J. L. Ku, A. Lee, J.C.Y. Huang","doi":"10.1109/IMPACT.2009.5382226","DOIUrl":null,"url":null,"abstract":"The Package on Package (PoP) component is getting attentions in mobile communication electronics industry to meet the miniaturization requirements. The 3D IC packaging technology is employed to achieve higher integrations for multiple functions. This also concurrently reduces the size of PCB during second level of interconnection. Currently, there are two major approaches for system manufactures. The first approach is to purchase the stacked PoP from component supplier. The alternative is to assemble the non-stacked PoP components in house.","PeriodicalId":6410,"journal":{"name":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","volume":"55 1","pages":"493-496"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"The evaluation of assembly process for package on package components\",\"authors\":\"K. C. Li, J. L. Ku, A. Lee, J.C.Y. Huang\",\"doi\":\"10.1109/IMPACT.2009.5382226\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The Package on Package (PoP) component is getting attentions in mobile communication electronics industry to meet the miniaturization requirements. The 3D IC packaging technology is employed to achieve higher integrations for multiple functions. This also concurrently reduces the size of PCB during second level of interconnection. Currently, there are two major approaches for system manufactures. The first approach is to purchase the stacked PoP from component supplier. The alternative is to assemble the non-stacked PoP components in house.\",\"PeriodicalId\":6410,\"journal\":{\"name\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"volume\":\"55 1\",\"pages\":\"493-496\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2009-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IMPACT.2009.5382226\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2009.5382226","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
The evaluation of assembly process for package on package components
The Package on Package (PoP) component is getting attentions in mobile communication electronics industry to meet the miniaturization requirements. The 3D IC packaging technology is employed to achieve higher integrations for multiple functions. This also concurrently reduces the size of PCB during second level of interconnection. Currently, there are two major approaches for system manufactures. The first approach is to purchase the stacked PoP from component supplier. The alternative is to assemble the non-stacked PoP components in house.
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