O. Patterson, Hsiao-Chi Peng, Haokun Hu, C. Huang, Panneerselvam Venkatachalam
{"title":"创造性地使用矢量扫描进行有效的SRAM检查","authors":"O. Patterson, Hsiao-Chi Peng, Haokun Hu, C. Huang, Panneerselvam Venkatachalam","doi":"10.1109/ASMC49169.2020.9185264","DOIUrl":null,"url":null,"abstract":"A simple way to gain 3 to 5x throughput for SRAM E-beam inspection (EBI) through innovative application of Vector Scan Technology is described. EBI, despite many unique advantages, is limited by throughput. Vector Scan technology, developed for patterning weak point inspection, allows hot spots within a very large field of view (FOV) to be scanned, thereby saving both move time plus time wasted on uninteresting pixels. This technology was adapted for VC inspection of SRAM, a common yield driver vehicle, at GLOBALFOUNDRIES for the development of a recent technology, providing an effective throughput gain of 4.2x, for three heavily used inspections.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"40 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Creative Use of Vector Scan for Efficient SRAM Inspection\",\"authors\":\"O. Patterson, Hsiao-Chi Peng, Haokun Hu, C. Huang, Panneerselvam Venkatachalam\",\"doi\":\"10.1109/ASMC49169.2020.9185264\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A simple way to gain 3 to 5x throughput for SRAM E-beam inspection (EBI) through innovative application of Vector Scan Technology is described. EBI, despite many unique advantages, is limited by throughput. Vector Scan technology, developed for patterning weak point inspection, allows hot spots within a very large field of view (FOV) to be scanned, thereby saving both move time plus time wasted on uninteresting pixels. This technology was adapted for VC inspection of SRAM, a common yield driver vehicle, at GLOBALFOUNDRIES for the development of a recent technology, providing an effective throughput gain of 4.2x, for three heavily used inspections.\",\"PeriodicalId\":6771,\"journal\":{\"name\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"40 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC49169.2020.9185264\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185264","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Creative Use of Vector Scan for Efficient SRAM Inspection
A simple way to gain 3 to 5x throughput for SRAM E-beam inspection (EBI) through innovative application of Vector Scan Technology is described. EBI, despite many unique advantages, is limited by throughput. Vector Scan technology, developed for patterning weak point inspection, allows hot spots within a very large field of view (FOV) to be scanned, thereby saving both move time plus time wasted on uninteresting pixels. This technology was adapted for VC inspection of SRAM, a common yield driver vehicle, at GLOBALFOUNDRIES for the development of a recent technology, providing an effective throughput gain of 4.2x, for three heavily used inspections.