基于Ansys / Comsol的多物理场软件基准测试应用于RF MEMS开关封装仿真

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1644011

D. Peyrou, P. Pons, H. Granier, D. Leray, A. Ferrand, K. Yacine, M. Saadaoui, A. Nicolas, J. Tao, R. Plana

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引用次数: 7

摘要

本文对COMSOL和ANSYS提供的多物理场软件可靠性进行了研究。我们的目标是通过三个例子来概述如何建立RF模拟，机械接触和残余应力的基本原理，这些例子被选为主要关键点，以便在未来建立RF MEMS开关封装的高度耦合模型

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Multiphysics Softwares Benchmark on Ansys / Comsol Applied For RF MEMS Switches Packaging Simulations

This paper presents a study on multiphysics software reliability provided by COMSOL and ANSYS. The goal is to give an overview about the fundamentals of how to set up RF simulations, mechanical contact and residual stress through three examples chosen as the main key points in order to make in the future a highly coupled model of the RF MEMS switches packaging

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微纳电子与智能制造

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