Simulation study on thermal mechanical properties of 4×4 Micro-LED array in flip-chip bonding process

With the advent of the Micro-light-emitting diodes, it has become the focus of display and visible light communication research. However, as the LED chip size shrinks, the difficulty of integration increase gradually. Nowadays, the integration of Micro- LEDs in display is still a challenge for commercialization. In this work, we conducted a comparative study by finite element method simulation to reveal the influencing factors of bonding yield. The results show that stress concentrates at the junction of the bumps and electrodes of Micro-LED chips, and the stress concentration at the corner of Micro-LED array is more seriously. By altering the parameters of bumps, such as shapes and materials to reduce the stress and stress concentration. Numerical simulate results provide theoretical basis for reducing stress and stress concentration and optimizing the bump shape.