JEDEC的线键拉力测试方法的生成以解决铜线键的拉力问题

Curtis Grosskopf
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The industry also developed specialty bonds such as security bonds, reverse bonds also called \"stitch on ball\", and even multi-loop wires and ribbons. In all that time neither the test procedure nor the minimum pull force values in Method 2011 were reviewed to determine their appropriateness for these new materials or new types of bonds, even though the industry widely referenced the test method for all of them and thus, by default, accepted its use for all of them.\n In late 2013, I led a working group within JEDEC's JC14.1 subcommittee, Reliability Test Methods for Packaged Devices, to update JEDEC JESD22-B116, Ball Bond Shear Test Method, to expand its scope to include the shearing of Cu ball bonds. It took the working group three years to address the necessary technical issues to ensure that the revised test method adequately addressed the shearing of copper ball bonds and propose minimum acceptable shear values. The working group produced a greatly improved document with drawings and images depicting the different shear fail modes of both gold and copper bonds and added several informative annexes to aid in the performing of the test method.\n By 2018 it was apparent that none of the most commonly referenced wire pull test methods in the electronics industry had made any significant progress in updating their documents to include Cu wire bonds. Therefore, the JC14.1 working group agreed to work jointly with the JC-13.7 Subcommittee, New Electronic Device Technology, to create a new, wire pull test method document under JC14.1 that would be a companion to the JESD22-B116. This new document will use Method 2011, Conditions C and D as its basis, but expand on its scope to cover copper wire bonds, both ultrasonic wedge and thermosonic ball bonds. The new test method will describe the process for a ball pull test and a stitch pull test that are referenced for copper bonds by AEC Q006, Qualification Requirement for Component Using Copper (Cu) Wire Interconnection. The test method will also provide guidance on how to perform pull testing on several different bond types used today including reverse bonds, multi-loop bonds, and stacked die. The working group plans to propose minimum pull values for copper wire bonds which JC14.1 will reference in JESD47, Stress-Test-Driven Qualification of Integrated Circuits. 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引用次数: 2

摘要

50多年前,当金属丝拉力测试方法最初被添加到Mil-Std 883中,在方法2011的条件D中,结合强度(破坏性结合拉力测试),测试程序和最小拉力值是基于对大多数超声波楔形结合铝和金线的拉力测试,只有几个不同的直径。从原始数据中推断出的最小拉力值适用于更大范围的金线和铝线直径。自从这种测试方法发布以来,电子行业已经制造了铜超声楔形键,大约15年前广泛采用铜热超声球键合,甚至开发了银热超声球键合的利基市场。该行业还开发了特种债券,如证券债券,反向债券也被称为“针上球”,甚至多环线和丝带。在所有这些时间里,测试程序和方法2011中的最小拉力值都没有经过审查,以确定它们对这些新材料或新型键的适用性,尽管行业广泛引用了所有这些测试方法,因此默认情况下接受了所有这些测试方法的使用。2013年底,我在JEDEC的JC14.1小组委员会“封装器件可靠性测试方法”中领导了一个工作组,更新JEDEC JESD22-B116“球键剪切测试方法”,将其范围扩大到包括Cu球键剪切。工作组花了三年时间来解决必要的技术问题,以确保修订后的测试方法充分解决铜球键的剪切问题,并提出可接受的最小剪切值。工作组制作了一份大大改进的文件,其中包含了描绘金键和铜键不同剪切破坏模式的图纸和图像,并增加了几个信息附件,以帮助执行测试方法。到2018年,很明显,电子行业中最常用的拉线测试方法都没有在更新其文件以包括铜线键合方面取得任何重大进展。因此,JC14.1工作组同意与JC-13.7新电子设备技术小组委员会共同合作,在JC14.1下创建一个新的拉丝测试方法文件,该文件将成为JESD22-B116的伴侣。本新文件将使用方法2011,条件C和D作为其基础,但扩展其范围,包括铜线键合,超声楔形键合和热超声球键合。新的测试方法将描述AEC Q006《使用铜(Cu)线互连的组件的资格要求》中铜键参考的球拉试验和针拉试验的过程。该测试方法还将提供如何对几种不同类型的键进行拉测试的指导,包括反向键、多环键和堆叠模。工作组计划提出铜线键合的最小拉力值,JC14.1将在JESD47《集成电路应力测试驱动鉴定》中引用。联合工作组完成工作后,针对在2022年的某个时候,JC13.7将能够使用该工作组2011年更新方法的输出条件C & d .本文将首先简要讨论更新B116覆盖铜导线债券,但主要集中在迄今为止完成的功联合工作组,包括拟议中的新文档的大纲,JESD22-B120,打金线拉力测试方法。
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JEDEC's Generation of Wire Bond Pull Test Methods to Address Pulling of Copper Wire Bonds
More than 50 years ago when the wire pull test method was initially added to Mil-Std 883, in Condition D of Method 2011, Bond Strength (Destructive Bond Pull Test), the test procedure and minimum pull force values were based on pull testing of mostly ultrasonic wedge bonded aluminum and gold wires of just a few different diameters. The minimum pull force values from that original data were extrapolated to cover a much wider range of wire diameters for both gold and aluminum wires. Since the release of this test method the electronics industry has manufactured copper ultrasonic wedge bonds, widely adopted copper thermosonic ball bonding roughly 15 years ago, and even developed a niche market for silver thermosonic ball bonding. The industry also developed specialty bonds such as security bonds, reverse bonds also called "stitch on ball", and even multi-loop wires and ribbons. In all that time neither the test procedure nor the minimum pull force values in Method 2011 were reviewed to determine their appropriateness for these new materials or new types of bonds, even though the industry widely referenced the test method for all of them and thus, by default, accepted its use for all of them. In late 2013, I led a working group within JEDEC's JC14.1 subcommittee, Reliability Test Methods for Packaged Devices, to update JEDEC JESD22-B116, Ball Bond Shear Test Method, to expand its scope to include the shearing of Cu ball bonds. It took the working group three years to address the necessary technical issues to ensure that the revised test method adequately addressed the shearing of copper ball bonds and propose minimum acceptable shear values. The working group produced a greatly improved document with drawings and images depicting the different shear fail modes of both gold and copper bonds and added several informative annexes to aid in the performing of the test method. By 2018 it was apparent that none of the most commonly referenced wire pull test methods in the electronics industry had made any significant progress in updating their documents to include Cu wire bonds. Therefore, the JC14.1 working group agreed to work jointly with the JC-13.7 Subcommittee, New Electronic Device Technology, to create a new, wire pull test method document under JC14.1 that would be a companion to the JESD22-B116. This new document will use Method 2011, Conditions C and D as its basis, but expand on its scope to cover copper wire bonds, both ultrasonic wedge and thermosonic ball bonds. The new test method will describe the process for a ball pull test and a stitch pull test that are referenced for copper bonds by AEC Q006, Qualification Requirement for Component Using Copper (Cu) Wire Interconnection. The test method will also provide guidance on how to perform pull testing on several different bond types used today including reverse bonds, multi-loop bonds, and stacked die. The working group plans to propose minimum pull values for copper wire bonds which JC14.1 will reference in JESD47, Stress-Test-Driven Qualification of Integrated Circuits. After the joint working group completes its work, which is targeted for some time in 2022, JC13.7 would then be able to use the output of this working group to update Method 2011 Conditions C & D. This paper will first briefly discuss the updates made to B116 to cover Cu wire bonds, but mainly focus on the work that has so far been completed by the joint working group, including a general outline of the proposed new document, JESD22-B120, Wire Bond Pull Test Methods.
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