密封凸焊密封的研究进展

T. Salzer
{"title":"密封凸焊密封的研究进展","authors":"T. Salzer","doi":"10.4071/2380-4505-2019.1.000550","DOIUrl":null,"url":null,"abstract":"\n In this article, we describe a novel process for hermetic projection weld sealing of semiconductor devices, considered by many to be an important legacy technology from decades gone bye, but not particularly relevant in today's arsenal of sealing technologies. We will demonstrate that with appropriate modifications to be described, this technology can used to seal various high power devices as well as high reliability semiconductors, crystals, hybrid packages, medical electronics, photonic devices, automotive electronics, etc. Its features primarily stem from the fact that it can be used to quickly and efficiently produce true hermetic seals in components. The welding is so rapid, that it is essentially a room temperature technology and the equipment is small enough that it can be housed in an atmosphere controlled chamber filled with any gas that is not explosive. Air, Nitrogen, Argon, Helium and their mixtures are the most commonly utilized gasses. The process is so adiabatic that it can be used to seal many liquids also. In some applications the technology competes against pulsed laser welding, but unlike laser welding the entire seal takes place in a few milliseconds because it is a single discharge, component-shaped spot/projection weld, which means that the entire seam is made in a single high speed discharge. So, in the same time that it takes a laser welding machine to make one of the many small overlapping spot welds required to make a seal, the projection welder has completed the entire operation. This process results in minimal stress and distortion, and maximum hermetic properties, strength and reliability, without requiring electroplating or preforms. Because the weld involves the localized high speed melting of metals, it among the highest energy density processes. A concern with the earlier resistance welding technologies has been the expulsion of particulates, both out of, and into the seal. This expulsion has been systemic and becomes progressively worse as the package size increases. In the course of this presentation we will demonstrate how this concern has been dealt with and corrected. Internal dew points can be held to −40 degrees, or lower if required. Other common applications for this technology include sealing and welding of nuts and studs for hermetic applications and sealing of devices for medical applications that must endure autoclave sterilization. In the course of this presentation, we will take you back to the roots of the original resistance welding process as taught by the early process developers so that you will understand how things have changed, and the reasons for the changes.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"189 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Advances in Hermetic Projection Weld Sealing\",\"authors\":\"T. Salzer\",\"doi\":\"10.4071/2380-4505-2019.1.000550\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n In this article, we describe a novel process for hermetic projection weld sealing of semiconductor devices, considered by many to be an important legacy technology from decades gone bye, but not particularly relevant in today's arsenal of sealing technologies. We will demonstrate that with appropriate modifications to be described, this technology can used to seal various high power devices as well as high reliability semiconductors, crystals, hybrid packages, medical electronics, photonic devices, automotive electronics, etc. Its features primarily stem from the fact that it can be used to quickly and efficiently produce true hermetic seals in components. The welding is so rapid, that it is essentially a room temperature technology and the equipment is small enough that it can be housed in an atmosphere controlled chamber filled with any gas that is not explosive. Air, Nitrogen, Argon, Helium and their mixtures are the most commonly utilized gasses. The process is so adiabatic that it can be used to seal many liquids also. In some applications the technology competes against pulsed laser welding, but unlike laser welding the entire seal takes place in a few milliseconds because it is a single discharge, component-shaped spot/projection weld, which means that the entire seam is made in a single high speed discharge. So, in the same time that it takes a laser welding machine to make one of the many small overlapping spot welds required to make a seal, the projection welder has completed the entire operation. This process results in minimal stress and distortion, and maximum hermetic properties, strength and reliability, without requiring electroplating or preforms. Because the weld involves the localized high speed melting of metals, it among the highest energy density processes. A concern with the earlier resistance welding technologies has been the expulsion of particulates, both out of, and into the seal. This expulsion has been systemic and becomes progressively worse as the package size increases. In the course of this presentation we will demonstrate how this concern has been dealt with and corrected. Internal dew points can be held to −40 degrees, or lower if required. Other common applications for this technology include sealing and welding of nuts and studs for hermetic applications and sealing of devices for medical applications that must endure autoclave sterilization. In the course of this presentation, we will take you back to the roots of the original resistance welding process as taught by the early process developers so that you will understand how things have changed, and the reasons for the changes.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"189 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/2380-4505-2019.1.000550\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.000550","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

摘要

在本文中,我们描述了半导体器件的密封投影焊接密封的新工艺,许多人认为这是几十年前的重要传统技术,但在当今的密封技术库中并不特别相关。我们将证明,通过适当的修改,该技术可用于密封各种高功率器件以及高可靠性半导体,晶体,混合封装,医疗电子,光子器件,汽车电子等。它的特点主要源于这样一个事实,即它可以用来快速有效地生产真正的密封组件。焊接是如此之快,本质上是一种室温技术,设备足够小,可以被安置在一个充满任何非爆炸性气体的大气控制室中。空气、氮气、氩气、氦气及其混合物是最常用的气体。这个过程是绝热的,它也可以用来密封许多液体。在某些应用中,该技术与脉冲激光焊接相竞争,但与激光焊接不同的是,整个密封在几毫秒内完成,因为它是单次放电,组件形状的点/投影焊接,这意味着整个焊缝是在一次高速放电中完成的。因此,在需要激光焊接机制作一个密封所需的许多小重叠点焊中的一个的同时,投影焊机已经完成了整个操作。该工艺的结果是最小的应力和变形,最大的密封性能,强度和可靠性,而不需要电镀或预成型。由于焊接过程涉及金属的局部高速熔化,因此是能量密度最高的过程之一。早期电阻焊技术的一个问题是将微粒排出密封件内外。这种驱逐是系统性的,并且随着包装规模的增加而逐渐恶化。在这次演讲中,我们将展示如何处理和纠正这个问题。内部露点可以保持在- 40度,或更低,如果需要。该技术的其他常见应用包括密封应用的螺母和螺柱的密封和焊接,以及必须承受高压灭菌器灭菌的医疗应用设备的密封。在本次演讲的过程中,我们将带您回到早期工艺开发人员所教授的原始电阻焊工艺的根源,以便您了解事情是如何变化的,以及变化的原因。
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Advances in Hermetic Projection Weld Sealing
In this article, we describe a novel process for hermetic projection weld sealing of semiconductor devices, considered by many to be an important legacy technology from decades gone bye, but not particularly relevant in today's arsenal of sealing technologies. We will demonstrate that with appropriate modifications to be described, this technology can used to seal various high power devices as well as high reliability semiconductors, crystals, hybrid packages, medical electronics, photonic devices, automotive electronics, etc. Its features primarily stem from the fact that it can be used to quickly and efficiently produce true hermetic seals in components. The welding is so rapid, that it is essentially a room temperature technology and the equipment is small enough that it can be housed in an atmosphere controlled chamber filled with any gas that is not explosive. Air, Nitrogen, Argon, Helium and their mixtures are the most commonly utilized gasses. The process is so adiabatic that it can be used to seal many liquids also. In some applications the technology competes against pulsed laser welding, but unlike laser welding the entire seal takes place in a few milliseconds because it is a single discharge, component-shaped spot/projection weld, which means that the entire seam is made in a single high speed discharge. So, in the same time that it takes a laser welding machine to make one of the many small overlapping spot welds required to make a seal, the projection welder has completed the entire operation. This process results in minimal stress and distortion, and maximum hermetic properties, strength and reliability, without requiring electroplating or preforms. Because the weld involves the localized high speed melting of metals, it among the highest energy density processes. A concern with the earlier resistance welding technologies has been the expulsion of particulates, both out of, and into the seal. This expulsion has been systemic and becomes progressively worse as the package size increases. In the course of this presentation we will demonstrate how this concern has been dealt with and corrected. Internal dew points can be held to −40 degrees, or lower if required. Other common applications for this technology include sealing and welding of nuts and studs for hermetic applications and sealing of devices for medical applications that must endure autoclave sterilization. In the course of this presentation, we will take you back to the roots of the original resistance welding process as taught by the early process developers so that you will understand how things have changed, and the reasons for the changes.
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