基于非对称四点弯曲技术的新型MEMS材料抗剪强度评估

M. Ogawa, Y. Isono
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引用次数: 4

摘要

本文描述了一种基于非对称四点弯曲(AFPB)方法的新型MEMS材料剪切测试技术(Izumi and Ping, 2005)。本研究开发了一种能够对带有“U”形缺口的微单晶硅(SCS)试样施加简单剪应力加载的剪切测试仪和AFPB试样,以估计SCS试样在剪应力作用下的抗剪强度和断裂行为。因此,我们首次成功地在微观尺度上评价了SCS的抗剪强度和剪切应变。在(110)平面上,SCS在[112]方向上的平均剪切模量为53.7 GPa,接近理论值。SCS的抗剪强度在1.0 ~ 1.3 GPa之间。观察了剪切应力作用下的断裂行为。裂纹在u形缺口底部滑移面上萌生,沿有限元预测的最大主应力方向垂直扩展。
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Novel shear strength evaluation of MEMS materials using asymmetrical four-point bending technique
This paper describes a novel shear testing technique for MEMS materials based on an asymmetrical four-point bending (AFPB) method (Izumi and Ping, 2005). This research has newly developed a shear tester and a AFPB test specimen that are able to apply simple shear stress loading to a micro single crystal silicon (SCS) specimen with "U" shaped notches (U-notches), in order to estimate shear strength and to observed fracture behavior for the SCS specimens under shear stressing. Consequently, we have, for the first time, succeeded in evaluating the shear strength and shear strain of SCS on a microscale. Averaged shear modulus of SCS was obtained 53.7 GPa in [112] direction on (110) plane, which was close to theoretical value. The shear strength of SCS ranged from 1.0 to 1.3 GPa. The fracture behavior under the shear stressing was observed. The crack initiated on the slip plane at the bottom of U-notches, whereas it propagated perpendicularly to the maximum principal stress direction predicted by FEM.
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