Chiplets Heterogeneous Integration on High-Density Hybrid Substrate Using an Interconnect-Layer

In this study, a high-density organic hybrid substrate for chiplets heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and characterization of the hybrid substrate with an interconnect-layer. A non-linear finite element analysis is performed to show the state of stress at the vias filled with a conductive paste of the interconnect-layer.