玻璃晶圆激光切割的产量和材料利用率

A. Gaab, Christian J. Wagner, Priyanka Khera
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引用次数: 1

摘要

激光切割直径达300毫米的玻璃晶圆,为玻璃基产品的切割提供了高质量和高吞吐量的解决方案。该技术可应用于微流体,ME(O)MS和其他半导体应用的玻璃晶圆,如传感器覆盖玻璃。基于每晶圆片的芯片计算和激光和破碎技术的标称加工速度,可以计算出小型芯片每小时的晶圆性能。例如,在直径为300毫米的晶圆上设计一个3毫米见方的模具,预计每小时可切割约10片晶圆。对康宁®HPFS®熔融石英(HPFS)玻璃晶圆片的示例性研究表明,其在切屑和边缘质量方面具有卓越的性能,并提供了一个质量,其中切屑性能优于50 μm,具有非常精确的边缘和模角。
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Throughput and Material Utilization by Glass Wafer Laser Dicing
Laser-based dicing of glass wafers for up to 300 mm diameter provides a high quality as well as a high throughput solution for dicing of glass-based products. This technology can be applied to glass wafers for Microfluidic, ME(O)MS and other semiconductor applications as for sensor cover glasses. Based on a die per wafer calculation and nominal processing speeds for laser and breaking technologies, a wafer per hour performance for small dies can be calculated. e.g. for a 3 mm square die design on a 300 mm diameter wafers, a dicing takt of ~10 wafers per hours can be expected. Exemplary investigations of a Corning® HPFS® Fused Silica (HPFS) glass wafer demonstrate the exceptional performance for chipping and edge quality and provide a quality, where the chipping performance is better than 50 μm with very precise edges and die corners.
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