固体电介质直流击穿的空间电荷和厚度相关

G. Chen, Junwei Zhao
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引用次数: 4

摘要

提出了一种基于空间电荷动力学的甚强直流电场下介质击穿的新模型。由于新的电荷映射技术的发展,人们对高电场下的空间电荷现象进行了几十年的研究。大量证据表明,在强电场作用下,材料中可以形成电荷包。电荷包的形成和动力学将导致局部电场增强,这对击穿有直接影响。研究发现,负的微分迁移率和低的俘获系数是导致电荷包形成的关键因素。将这些因素纳入到基于空间电荷的模型中,我们的仿真结果清楚地表明,击穿与样品厚度有关。通过仿真发现,击穿电场的减小取决于击穿发生时临界电场的起始等几个参数。通过改变直流施加电压的斜坡率,仿真也表明击穿强度随电压斜坡率的增加而增加。
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Space charge and thickness dependent dc electrical breakdown of solid dielectrics
A new model based on space charge dynamics under very high dc electric field has been proposed to explain thickness dependent dielectric breakdown. Space charge phenomenon under high electric field has been studied for several decades thanks to the development of new charge mapping techniques. Overwhelming evidences show that the charge packet can be formed in the material under high electric field. The formation and dynamics of the charge packet will result in local electric field enhancement that has a direct impact on breakdown. It has been found that the key factors leading to the formation of charge packet are negative differential mobility and low trapping coefficient. Take these factors into the space charge based model, our simulation results clearly show that the breakdown is dependent on the sample thickness. Through the simulation, it has been noticed that the electrical breakdown field reduction depends on several parameters such as the onset of critical electric field when breakdown occurs. By varying the ramp rate of dc applied voltage, simulation has also shown that the breakdown strength increases with the voltage ramp rate.
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