绝缘体上硅的赝线电子束再结晶

Susumu Horita, Hiroshi Ishiwara
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引用次数: 1

摘要

伪线电子束(e- line electron beam,简称e- line电子束)是通过扫描点电子束沿直线产生的,其速度比衬底的热响应时间快,这对于绝缘体上硅(SOI)结构的再结晶具有优势,因为沿直线的温度分布可以通过扫描信号的波形精确控制。本文综述了伪线电子束再结晶方法的研究现状,重点讨论了再结晶膜中空洞的产生和亚边界的产生这两个关键问题。首先,为了预测加热过程中的温度分布,分别使用Kirchhoff变换和Green函数分析对静态和动态情况下的热方程进行求解。然后,通过实验研究了孔洞和子边界的生成机理,建立了相应的生成模型。结果表明,孔洞是由SOI薄膜中孤立的熔融点产生的,而矩形种子区沿直线分开排列的穿孔种子结构可以有效地抑制孔洞的产生。在固液界面处形成的折叠面内角处产生了子边界。本文还研究了伪线电子束的斜向扫描、扫描方向和扫描波形的优化、粒子方向的优化、双缺陷的产生、亚边界方向与电子束扫描速度的关系等问题。得到了面积为100 μm²的SOI单晶。
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Pseudoline electron beam recrystallization of silicon-on-insulator

A pseudoline electron beam (e-beam) which is produced by scanning a spot e-beam along a line faster than the thermal response time of the substrate, has an advantage for recrystallization of silicon-on-insulator (SOI) structures in that the temperature profile along the line can be precisely controlled by the waveform of the scanning signal. In this paper, the current status of the pseudoline e-beam recrystallization method is reviewed, being focused on two essential problems: void generation and subboundary generation in the recrystallized films. First, in order to predict the temperature distribution during heating, the heat equation is solved for both static and dynamic cases using the Kirchhoff transformation and the Green function analysis, respectively. Then, generation mechanisms of voids and subboundaries are experimentally studied and the respective generation models are set up. It is concluded that voids are generated from isolated molten spots in the SOI film and a perforation seed structure in which rectangular seed regions are separately arranged along a line, is effective to suppress them. It is also concluded that subboundaries are generated at the interior corners of the folded 11facets which are formed at the solid-liquid interface. Other topics included in this paper are oblique scanning of the pseudoline e-beam, optimization of the scanning direction and scanning waveform, optimization of the seed direction, generation of twin defects, relation between the subboundary direction and the scanning velocity of the beam, and so on. As a result, a single-crystal SOI area of 100 μm square has been obtained.

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