精确模拟应力场在双材料梁使用现成的数学软件

C. Kinsella, T. Moore, J. Jarvis
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引用次数: 0

摘要

赫斯在1969年提出了一个很少使用的第一原理解,用于任意自平衡自由端载荷下双材料弹性梁的应力场。本文利用Matlab实现Hess解,计算梁在任意要求的水平或垂直截面处的轴向应力和法向应力。该方法使用数值方法对任意给定的层厚度和材料特性集开发特征值解。一种新的有限元网格设计,最初是由Schiermeier和Szabo于1989年提出的,用于验证上述分析的结果。(p元素的)网格围绕奇点进行强烈分级,确保它们的影响是隔离的。模型中较偏远的区域,应力和梯度较低,稀疏地分布着元素。这种网格设计有效地解决了自由边缘附近界面剥离应力和界面剪切应力的快速变化。用这两种方法对双材料梁的应力场进行了检测。虽然这两种方法都可以用于计算梁中任何所需水平或垂直截面的应力,但第一性原理法的优点是不需要有限元分析软件。相反,Excel或Matlab可以很容易地显示所选截面的应力分布图。该方法可应用于双材料梁的轴向、剪切和剥落(正)应力。该解决方案在许多不同的工程领域都有应用,从IC封装的热应力到机械负载下装甲镀的行为
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Exact Modelling of Stress Fields In Bimaterial Beams Using Readily Available Mathematical Software
A little-used first principles solution was proposed by Hess in 1969 for the stress fields in a bimaterial elastic beam under any arbitrary self equilibrating free end loading. In this paper Hess's solution is implemented using Matlab to calculate axial and normal stresses at any required horizontal or vertical cross-section of the beam. The approach uses numerical methods to develop an eigenvalue solution for any given set of layer thicknesses and material properties. A novel finite element mesh design, originally presented in 1989 by Schiermeier and Szabo, is used to validate the results from the above analysis. The mesh (of p-elements) is strongly graded around singularities, ensuring their effects are isolated. More remote areas of the model, where stresses and gradients are low, are sparsely populated by elements. The rapid changes in interfacial peeling stress and interfacial shear stress close to the free edge are coped with quite effectively by this mesh design. The two methods are used to examine the stress fields in the bimaterial beam. Although both methods can be used to calculate stresses at any required horizontal or vertical cross-section in the beam, the first principles method has the advantage of not requiring FEA software. Instead Excel or Matlab can readily display a plot of the stress distribution in the selected cross section. The method can be applied to axial, shear and peeling (normal) stresses in bimaterial beams. The solution has applications in many varied areas of engineering, from thermal stresses in IC packages to the behaviour of armour plating under mechanical loads
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