{"title":"基于卷积神经网络和分布式计算的晶圆缺陷自动分类","authors":"Hairong Lei, Cho-Huak Teh, Hetong Li, Po-Hsuan Lee, Wei Fang","doi":"10.1109/ASMC49169.2020.9185253","DOIUrl":null,"url":null,"abstract":"This research compares the traditional machine learning algorithms and deep learning technology. We report our distributed computing convolutional neural network deep learning platform design and results in wafer defect classification. The result shows that the classification accuracy and purity performance is better than that of traditional machine learning models like Random Forest.","PeriodicalId":6771,"journal":{"name":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","volume":"9 9 1","pages":"1-5"},"PeriodicalIF":0.0000,"publicationDate":"2020-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Automated Wafer Defect Classification using a Convolutional Neural Network Augmented with Distributed Computing\",\"authors\":\"Hairong Lei, Cho-Huak Teh, Hetong Li, Po-Hsuan Lee, Wei Fang\",\"doi\":\"10.1109/ASMC49169.2020.9185253\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This research compares the traditional machine learning algorithms and deep learning technology. We report our distributed computing convolutional neural network deep learning platform design and results in wafer defect classification. The result shows that the classification accuracy and purity performance is better than that of traditional machine learning models like Random Forest.\",\"PeriodicalId\":6771,\"journal\":{\"name\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"volume\":\"9 9 1\",\"pages\":\"1-5\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-08-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC49169.2020.9185253\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 31st Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASMC49169.2020.9185253","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Automated Wafer Defect Classification using a Convolutional Neural Network Augmented with Distributed Computing
This research compares the traditional machine learning algorithms and deep learning technology. We report our distributed computing convolutional neural network deep learning platform design and results in wafer defect classification. The result shows that the classification accuracy and purity performance is better than that of traditional machine learning models like Random Forest.