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引用次数: 4
摘要
近年来，低银Sn-Ag-Cu (SAC)钎料的开发由于钎焊的可靠性和成本问题而成为电子封装行业的一个新的研究领域。研究了SAC/Cu和SAC- bi - ni /Cu两种低银钎料的抗剪强度和界面显微组织。结果表明，在低银SAC0705钎料中添加Ni和Bi，提高了钎料的抗剪强度，降低了合金的断裂延展性。当添加3.5% Bi和0.1% Ni时，抗剪强度由11.09MPa提高到19.51MPa。对于本研究的低银焊点，剪切韧窝主要出现在大块焊料和界面IMC之间的界面上。
Shear strength and interfacial microstructures of low-Ag SAC/Cu and SAC-Bi-Ni/Cu solder joints
Recently, the development of low-Ag Sn-Ag-Cu (SAC) solders has become a new research field in electronic packaging industry because of the braze reliability and cost concerns. In this study, the shear strength and interfacial microstructures of two kinds of low-Ag solder joints, SAC/Cu and SAC-Bi-Ni/Cu, were investigated. The results obtained affirmed that the addition of Ni and Bi in low-Ag SAC0705 solder improves the shear strength of the solder joints and decreases the fracture ductility of the alloy. With 3.5% Bi and 0.1% Ni addition, the shear strength increases from 11.09MPa to 19.51MPa. For low-Ag solder joints investigated in this research, the shear dimples mostly appear at the interface between bulk solder and interfacial IMC.
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