MAXQFP:恩智浦面向汽车应用的全新封装解决方案

C. Lee, T. Tran, A. Mawer, Xs Pang, J. Yao
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引用次数: 0

摘要

介绍了用于汽车工业的172引脚(16x16毫米车身尺寸)和100引脚(10x10毫米车身尺寸)MAXQFP和172 MAXQFP_EP(暴露垫)。与标准LQFP/QFP包相比,MAXQFP的优势将被概述。热力学仿真结果证明了该方法优于传统的LQFP和LQFP_EP。简要地解决了MAXQFP在制造,设计和更紧密的引线投球方面的挑战。将展示解决这些挑战的方法和数据。例如,锡晶须和锡迁移都是MAXQFP关注的问题,因为相邻导联之间的距离更小。已收集板级焊点可靠性(SJR)以证明其符合AEC G1标准。提出了MAXQFP j型引线焊接接头的目视检测方法及对AOI(自动对象检测)系统的要求。总结了AEC Q100中定义的标准AEC G1组件级可靠性应力,即TC(温度循环),HTSL(高温储存寿命),THB(温度湿度偏置)和uHAST(无偏置)测试。由于使用了铜线,因此也收集了AEC Q006数据。描述了装配方面的挑战。对今后的工作进行总结。
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MAXQFP: NXP's new package solution for automotive application
172-lead (16x16 mm body size) and 100-lead (10x10 mm body size) MAXQFP's and 172 MAXQFP_EP (exposed pad) for automotive industry are introduced. The advantage of MAXQFP as compare to standard LQFP/QFP packages will be outlined. Thermal & mechanical simulation results were performed to prove its advantage over conventional LQFP and LQFP_EP. The challenges in manufacturing, designs and concerns of tighter lead pitches for MAXQFP are briefly addressed. Methods and data to resolve these challenges will be shown. For example, Sn whisker and Sn migration both are concerns to MAXQFP because of smaller distance between adjacent leads. The board-level solder joint reliability (SJR) has been collected to prove it is AEC G1 compliant. Visual inspection methods and requirements on AOI (automatic object inspection) systems on solider joints of J-leads of MAXQFP for are proposed. Standard AEC G1 component level reliability stresses defined at AEC Q100 which are TC (temperature cycling), HTSL (high temperature storage life), THB (Temperature Humidity Biased) and uHAST (un-biased HAST) tests are summarized Since Cu wires were used, AEC Q006 data are also collected. Assembly challenges are described. Future works will be summarized.
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