{"title":"倒装芯片和sip组件回流后粘度降低的助熔剂","authors":"R. Mao, Fen Chen, N. Lee","doi":"10.4071/2380-4505-2019.1.000127","DOIUrl":null,"url":null,"abstract":"\n A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the component placement and reflow stage, but ends up with a low viscosity flux residue after reflow, thus facilitating the flux residue to be cleaned. A technique for forming such special fluxes is to establish a temporary association force within the materials themselves, such as an acid-base association. This kind of association force can increase the apparent molecular weight and cause material viscosity to increase. After a heating process, one of the critical ingredients was evaporated, thus eliminating the association force, causing a decrease in the apparent molecular weight, and consequently a decrease in viscosity or an increase in mobility. The evaporation of one ingredient can be the result of one ingredient having a lower boiling point, or the decomposition of one ingredient during heating. A strong association force is desired to allow this acid-base combination approach to work. In this work, the volatile ingredient approach was less effective than a decomposable ingredient approach, presumably due to the formation of a bigger association cluster from the decomposable ingredient. Accordingly, the decomposable ingredient was the best approach to lower flux viscosity after reflow.","PeriodicalId":14363,"journal":{"name":"International Symposium on Microelectronics","volume":"54 1","pages":""},"PeriodicalIF":0.0000,"publicationDate":"2019-12-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY\",\"authors\":\"R. Mao, Fen Chen, N. Lee\",\"doi\":\"10.4071/2380-4505-2019.1.000127\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"\\n A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the component placement and reflow stage, but ends up with a low viscosity flux residue after reflow, thus facilitating the flux residue to be cleaned. A technique for forming such special fluxes is to establish a temporary association force within the materials themselves, such as an acid-base association. This kind of association force can increase the apparent molecular weight and cause material viscosity to increase. After a heating process, one of the critical ingredients was evaporated, thus eliminating the association force, causing a decrease in the apparent molecular weight, and consequently a decrease in viscosity or an increase in mobility. The evaporation of one ingredient can be the result of one ingredient having a lower boiling point, or the decomposition of one ingredient during heating. A strong association force is desired to allow this acid-base combination approach to work. In this work, the volatile ingredient approach was less effective than a decomposable ingredient approach, presumably due to the formation of a bigger association cluster from the decomposable ingredient. Accordingly, the decomposable ingredient was the best approach to lower flux viscosity after reflow.\",\"PeriodicalId\":14363,\"journal\":{\"name\":\"International Symposium on Microelectronics\",\"volume\":\"54 1\",\"pages\":\"\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-12-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Symposium on Microelectronics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.4071/2380-4505-2019.1.000127\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Symposium on Microelectronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.4071/2380-4505-2019.1.000127","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
FLUXES WITH DECREASED VISCOSITY AFTER REFLOW FOR FLIP-CHIP AND SIP ASSEMBLY
A series of flux systems have been developed which would result in a reduced viscosity after reflow. This enables a high viscosity, high tack flux to be used to secure components at the component placement and reflow stage, but ends up with a low viscosity flux residue after reflow, thus facilitating the flux residue to be cleaned. A technique for forming such special fluxes is to establish a temporary association force within the materials themselves, such as an acid-base association. This kind of association force can increase the apparent molecular weight and cause material viscosity to increase. After a heating process, one of the critical ingredients was evaporated, thus eliminating the association force, causing a decrease in the apparent molecular weight, and consequently a decrease in viscosity or an increase in mobility. The evaporation of one ingredient can be the result of one ingredient having a lower boiling point, or the decomposition of one ingredient during heating. A strong association force is desired to allow this acid-base combination approach to work. In this work, the volatile ingredient approach was less effective than a decomposable ingredient approach, presumably due to the formation of a bigger association cluster from the decomposable ingredient. Accordingly, the decomposable ingredient was the best approach to lower flux viscosity after reflow.