Maryna Lishchynska, C. O’Mahony, O. Slattery, O. Wittier
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Modelling effects of packaging on pull-in behaviour of doubly-anchored beams
Understanding the influence of the packaging process on MEMS device performance is critical for a successful design and analysis of both the device and the package. This paper is concerned with accurate prediction of the effects of packaging processes on the pull-in behaviour of doubly anchored microbeams. Results of parametric studies on the effect of gluing (die attach) on the pull-in behaviour of beams of various lengths, widths, anchor types, adhesives and adhesive thicknesses are presented. Where experimental data were available, a good correlation between measured and simulated results was achieved
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