三维自组装SOI MEMS的制造与运行建模

微纳电子与智能制造 Pub Date : 2006-04-24 DOI:10.1109/ESIME.2006.1643957

C. Méndez, C. Louis, S. Paquay, P. De Vincenzo, I. Klapka, V. Rochus, F. Iker, N. André, J. Raskin

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引用次数: 0

摘要

在本文中，我们提出了可以直接集成到电子元件上的平面外三维自组装SOI(绝缘体上硅)MEMS。由于其3D特性，这些结构可以用作热致动器或流量传感器的基本元件。我们对这些装置的制造和操作进行了描述，并展示了如何对这两个阶段进行数值模拟

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Modeling of the Fabrication and Operation of 3-D Self-Assembled SOI MEMS

In this paper we present out-of-plane 3D self assembled SOI (silicon-on-insulator) MEMS that can be directly integrated to the electronic components. Because of their 3D nature, these structures can be used, for instance, as the basic elements for the construction of thermal actuators or flow sensors. We make a description of the fabrication and operation of these devices and we show how these two stages can be numerically simulated

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微纳电子与智能制造

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145

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