Geometric Parameter Identification for Bulk-Micromachined Accelerometer from Modal Frequencies Measurements

A wafer-level testing method is investigated for an early stage of the manufacturing process applied to accelerometers. The approach consists of performing optical measurement of the modal responses of the MEMS structures, and uses this information in an inverse identification algorithm based on a FE model. Device characteristics can be determined by measured modal frequencies which are fed into a model based on the FE simulations. First measurements were done to validate the model and showed a good correlation between simulated and measured modal frequencies