双衬底单SnAgCu焊点快速热循环的电磁感应加热

Jibing Chen, B. An, Cong Li, Wei Guo, Yiping Wu
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引用次数: 10

摘要

本文研究了经电磁感应加热处理的焊点的热疲劳行为。采用扫描电子显微镜(SEM)和能量色散x射线系统(EDXS)分别对焊点的组织和成分进行了观察和分析。提出了高频电磁感应加热快速热循环的数值模拟方法。研究发现,快速热循环对SAC305钎料与Cu衬底之间的显微组织和IMC有明显的影响。结果表明:快速热循环后,钎料球的显微组织出现了明显的裂纹现象。结果表明,采用局部感应加热的方法研究焊点的热疲劳行为是可行的。该方法还可以有效地提高电子封装器件的可靠性。
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Electromagnetic induced heating for rapid thermal cycling of single SnAgCu solder joint in double substrates
The thermal fatigue behavior of the solder joint treated by electromagnetic induced heating is investigated in the present study. The microstructures and compositions of solder joints were observed and analyzed by scanning electron microscopy (SEM) and energy dispersive X-ray system (EDXS) respectively. An approach to rapid thermal cycles by high-frequency electromagnetic induction heating was also presented in terms of numerical simulation. It was found that rapid thermal cycle has an evident influence on the microstructure and IMC between SAC305 solder and Cu substrate. The results showed that there is a rimous cracks phenomenon in the microstructure of the solder balls after rapid thermal cycle. The results indicate that this method by local induction heating is feasible to investigate the thermal fatigue behaviors of solder joint. This method can also effectively improve the reliability of the electronic packaging devices.
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